Abstract: Robotic systems can be capable of collision detection and avoidance. A robotic medical system can include a robotic arm, an input device configured to receive one or more user inputs for controlling the robotic arm, and a display configured to provide information related to the robotic medical system. The display can include a first icon that is representative of the robotic arm and includes at least a first state and a second state. The robotic medical system can be configured to control movement of the robotic arm based on the user inputs received at the input device in real time, determine a distance between the robotic arm and a component, and provide information to the user about potential, near, and/or actual collisions between the arm and the component.

Abstract: A boat cover is built up from a series of overlapped wide strips of a covering material extending from side to side over the boat. The cover material includes a layer of felt bonded to the inside of a PVC sheeting leaving a narrow strip defining covered with the overlapped areas. An adhesive film, which is covered with a peelable non-adhesive cover. The overlapping areas are bonded together with a strippable adhesive film. A hem piece is attached to bottom portions of the strips encircling the boat hull, with a draw element within the hem tightened to securely grip the boat hull. Tie downs may further secure the cover to a boat trailer or other support for the boat.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A method and a device for detecting user input includes receiving a user input at an input arrangement of a user interface. The input arrangement has at least one piezoelectric sensor that generates an electric signal in response to the input. The electric signal is processed to determine the presence of the input. The processing may indicate the magnitude of the force of the input, in addition to the input's location. An output arrangement of the user interface generates an output in response to the processing. The output may be a haptic, audio or visual output.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A device and method are provided to drive piezoelectric elements in haptic applications. In one embodiment, a pattern generator provides user programmable PWM waveforms to a driver. The load of the driver is an inductor in series with the piezoelectric element. The filtration of the inductor in series with the capacitance of the piezoelectric element suppresses the high-frequency components of the PWM pulse train, and recovers a value commensurate with the duty cycle of the PWM pulse train. The resulting waveform across the piezoelectric element is converted to physical motion, thereby creating a haptic effect on a user interface. Advantageously, there is reduced power loss, reduced switching induced noise, and a more haptic rich environment.

Abstract: Embodiments of the present invention provide a user interface processing system for a device that may include at least one sensor, at least one output device, and a controller. The controller may include a memory, which may store instructional information, and a processor. The processor may be configured to receive sensor data from the at least one sensor and to interpret sensor data according to the instructional information. The processor may also generate a user interface feedback command and transmit the command to the at least one output device. Furthermore, the processor may report the sensor data to a host system of the device. By processing the sensor data and generating a corresponding feedback response, for example a haptic response, without the need for host system processing, the user interface controller may decrease latency in providing the feedback response to the user.