Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

Abstract: According to an aspect, the present invention is directed to a method for applying a label to a substrate. The method includes applying an ink layer to a transfer mechanism; applying a binding layer to the ink layer; and contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

Abstract: A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations.