Abstract: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.

Abstract: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.