Patents by Inventor Mark John MASLOW
Mark John MASLOW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111218Abstract: A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.Type: ApplicationFiled: November 6, 2023Publication date: April 4, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Hermanus Adrianus DILLEN, Marc Jurian KEA, Mark John MASLOW, Koen THUIJS, Peter David ENGBLOM, Ralph Timotheus HUIJGEN, Daan Maurits SLOTBOOM, Johannes Catharinus Hubertus MULKENS
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Publication number: 20240012337Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: ApplicationFiled: August 3, 2023Publication date: January 11, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Koenraad VAN INGEN SCHENAU, Patrick WARNAAR, Abraham SLACHTER, Roy ANUNCIADO, Simon Hendrik Celine VAN GORP, Frank STAALS, Marinus JOCHEMSEN
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Publication number: 20240004299Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.Type: ApplicationFiled: August 11, 2023Publication date: January 4, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Frank STAALS, Paul Christiaan HINNEN
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Patent number: 11860548Abstract: A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.Type: GrantFiled: February 6, 2020Date of Patent: January 2, 2024Assignee: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Hermanus Adrianus Dillen, Marc Jurian Kea, Mark John Maslow, Koen Thuijs, Peter David Engblom, Ralph Timotheus Huijgen, Daan Maurits Slotboom, Johannes Catharinus Hubertus Mulkens
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Patent number: 11847570Abstract: A method for training a deep learning model of a patterning process. The method includes obtaining (i) training data comprising an input image of at least a part of a substrate having a plurality of features and a truth image, (ii) a set of classes, each class corresponding to a feature of the plurality of features of the substrate within the input image, and (iii) a deep learning model configured to receive the training data and the set of classes, generating a predicted image, by modeling and/or simulation of the deep learning model using the input image, assigning a class of the set of classes to a feature within the predicted image based on matching of the feature with a corresponding feature within the truth image, and generating, by modeling and/or simulation, a trained deep learning model by iteratively assigning weights using a loss function.Type: GrantFiled: June 10, 2022Date of Patent: December 19, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Adrianus Cornelis Matheus Koopman, Scott Anderson Middlebrooks, Antoine Gaston Marie Kiers, Mark John Maslow
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Patent number: 11768442Abstract: A method including: obtaining an image of at least part of a substrate, wherein the image includes at least one feature of a device being manufactured in a layer on the substrate; obtaining a layout of features associated with a previous layer adjacent to the layer on the substrate; calculating one or more image-related metrics in dependence on: 1) a contour determined from the image including the at least one feature and 2) the layout; and determining one or more control parameters of a lithographic apparatus and/or one or more further processes in a manufacturing process of the device in dependence on the one or more image-related metrics, wherein at least one of the control parameters is determined to modify the geometry of the contour in order to improve the one or more image-related metrics.Type: GrantFiled: October 25, 2022Date of Patent: September 26, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Koenraad Van Ingen Schenau, Patrick Warnaar, Abraham Slachter, Roy Anunciado, Simon Hendrik Celine Van Gorp, Frank Staals, Marinus Jochemsen
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Patent number: 11733610Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.Type: GrantFiled: December 20, 2019Date of Patent: August 22, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Frank Staals, Paul Christiaan Hinnen
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Publication number: 20230058839Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: ApplicationFiled: October 25, 2022Publication date: February 23, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Koenraad VAN INGEN SCHENAU, Patrick WARNAAR, Abraham SLACHTER, Roy ANUNCIADO, Simon Hendrick Celine VAN GRORP, Frank STAALS, Marinus JOCHEMSEN
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Publication number: 20230042759Abstract: A method including: computing a value of a first variable of a pattern of, or for, a substrate processed by a patterning process by combining a fingerprint of the first variable on the substrate and a certain value of the first variable; and determining a value of a second variable of the pattern based at least in part on the computed value of the first variable.Type: ApplicationFiled: October 18, 2022Publication date: February 9, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Frank Staals, Mark John Maslow, Roy Anunciado, Marinus Jochemsen, Hugo Augustinus Joseph Cramer, Thomas Theeuwes, Paul Christiaan Hinnen
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Patent number: 11520239Abstract: A method including: computing a value of a first variable of a pattern of, or for, a substrate processed by a patterning process by combining a fingerprint of the first variable on the substrate and a certain value of the first variable; and determining a value of a second variable of the pattern based at least in part on the computed value of the first variable.Type: GrantFiled: February 17, 2017Date of Patent: December 6, 2022Assignee: ASML Netherlands B.V.Inventors: Wim Tjibbo Tel, Frank Staals, Mark John Maslow, Roy Anunciado, Marinus Jochemsen, Hugo Augustinus Joseph Cramer, Thomas Theeuwes, Paul Christiaan Hinnen
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Patent number: 11513442Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: GrantFiled: August 22, 2018Date of Patent: November 29, 2022Assignee: ASML Netherlands B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Koenraad Van Ingen Schenau, Patrick Warnaar, Abraham Slachter, Roy Anunciado, Simon Hendrik Celine Van Gorp, Frank Staals, Marinus Jochemsen
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Publication number: 20220375063Abstract: A system and method for generating predictive images for wafer inspection using machine learning are provided. Some embodiments of the system and method include acquiring the wafer after a photoresist applied to the wafer has been developed; imaging a portion of a segment of the developed wafer; acquiring the wafer after the wafer has been etched; imaging the segment of the etched wafer; training a machine learning model using the imaged portion of the developed wafer and the imaged segment of the etched wafer; and applying the trained machine learning model using the imaged segment of the etched wafer to generate predictive images of a developed wafer. Some embodiments include imaging a segment of the developed wafer; imaging a portion of the segment of the etched wafer; training a machine learning model; and applying the trained machine learning model to generate predictive after-etch images of the developed wafer.Type: ApplicationFiled: September 14, 2020Publication date: November 24, 2022Applicant: ASML Netherlands B.V.Inventors: Maxim PISARENCO, Scott Anderson MIDDLEBROOKS, Mark John MASLOW, Marie-Claire VAN LARE, Chrysostomos BATISTAKIS
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Publication number: 20220342316Abstract: Described herein is a method of training a model configured to predict whether a feature associated with an imaged substrate will be defective after etching of the imaged substrate and determining etch conditions based on the trained model. The method includes obtaining, via a metrology tool, (i) an after development image of the imaged substrate at a given location, the after development image including a plurality of features, and (ii) an after etch image of the imaged substrate at the given location; and training, using the after development image and the after etch image, the model configured to determine defectiveness of a given feature of the plurality of features in the after development image. In an embodiment, the determining of defectiveness is based on comparing the given feature in the after development image with a corresponding etch feature in the after etch image.Type: ApplicationFiled: September 3, 2020Publication date: October 27, 2022Applicant: ASML Netherlands B.V.Inventors: Marleen KOOIMAN, Maxim PISARENCO, Abraham SLACHTER, Mark John MASLOW, Bernardo Andres OYARZUN RIVERA, Wim Tjibbo TEL, Ruben Cornelis MAAS
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Publication number: 20220327686Abstract: A method for training a deep learning model of a patterning process. The method includes obtaining (i) training data comprising an input image of at least a part of a substrate having a plurality of features and a truth image, (ii) a set of classes, each class corresponding to a feature of the plurality of features of the substrate within the input image, and (iii) a deep learning model configured to receive the training data and the set of classes, generating a predicted image, by modeling and/or simulation of the deep learning model using the input image, assigning a class of the set of classes to a feature within the predicted image based on matching of the feature with a corresponding feature within the truth image, and generating, by modeling and/or simulation, a trained deep learning model by iteratively assigning weights using a loss function.Type: ApplicationFiled: June 10, 2022Publication date: October 13, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Adrianus Cornelis Matheus KOOPMAN, Scott Anderson Middlebrooks, Antoine Gaston Marie Kiers, Mark John Maslow
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Patent number: 11379970Abstract: A method for training a deep learning model of a patterning process. The method includes obtaining (i) training data including an input image of at least a part of a substrate having a plurality of features and including a truth image, (ii) a set of classes, each class corresponding to a feature of the plurality of features of the substrate within the input image, and (iii) a deep learning model configured to receive the training data and the set of classes, generating a predicted image, by modeling and/or simulation with the deep learning model using the input image, assigning a class of the set of classes to a feature within the predicted image based on matching of the feature with a corresponding feature within the truth image, and generating, by modeling and/or simulation, a trained deep learning model by iteratively assigning weights using a loss function.Type: GrantFiled: February 15, 2019Date of Patent: July 5, 2022Assignee: ASML Netherlands B.V.Inventors: Adrianus Cornelis Matheus Koopman, Scott Anderson Middlebrooks, Antoine Gaston Marie Kiers, Mark John Maslow
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Publication number: 20220100098Abstract: A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.Type: ApplicationFiled: February 6, 2020Publication date: March 31, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Hermanus Adrianus DILLEN, Marc Jurian KEA, Mark John MASLOW, Koen THUIJS, Peter David ENGBLOM, Ralph Timotheus HUIJGEN, Daan Maurits SLOTBOOM, Johannes Catharinus Hubertus MULKENS
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Publication number: 20210374936Abstract: A method for training a deep learning model of a patterning process. The method includes obtaining (i) training data including an input image of at least a part of a substrate having a plurality of features and including a truth image, (ii) a set of classes, each class corresponding to a feature of the plurality of features of the substrate within the input image, and (iii) a deep learning model configured to receive the training data and the set of classes, generating a predicted image, by modeling and/or simulation with the deep learning model using the input image, assigning a class of the set of classes to a feature within the predicted image based on matching of the feature with a corresponding feature within the truth image, and generating, by modeling and/or simulation, a trained deep learning model by iteratively assigning weights using a loss function.Type: ApplicationFiled: February 15, 2019Publication date: December 2, 2021Applicant: ASML NETHERLANDS B.V.Inventors: Adrianus Cornelis Matheus KOOPMAN, Scott Anderson MIDDLEBROOKS, Antoine Gaston Marie KIERS, Mark John MASLOW
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Publication number: 20210149312Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: ApplicationFiled: August 22, 2018Publication date: May 20, 2021Inventors: Wim Tjibbo TEL, Mark John MASLOW, Koenraad VAN INGEN SCHENAU, Patrick WARNAAR, Abraham SLACHTER, Roy ANUNCIADO, Simon Hendrik Celine VAN GORP, Frank STAALS, Marinus JOCHEMSEN
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Patent number: 10866523Abstract: A method for adjusting a lithography process, wherein processing parameters of the lithography process include a first group of processing parameters and a second group of processing parameters, the method including: obtaining a change of the second group of processing parameters; determining a change of a sub-process window (sub-PW) as a result of the change of the second group of processing parameters, wherein the sub-PW is spanned by only the first group of processing parameters; and adjusting the first group of processing parameters based on the change of the sub-PW.Type: GrantFiled: May 27, 2016Date of Patent: December 15, 2020Assignee: ASML Netherlands B.V.Inventors: Wim Tjibbo Tel, Frank Staals, Mark John Maslow
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Publication number: 20200124968Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John Maslow, Frank Staals, Paul Christiaan Hinnen