Patents by Inventor Mark K. Olearczyk

Mark K. Olearczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240326133
    Abstract: Some implementations of the disclosure are directed to an additive manufacturing build plate structure for metal build surface stabilization during 3D printing and facile release of 3D printed objects. The build plate includes a body having a recessed section formed through a first surface of the body, the recessed section including a bottom surface within the body and sidewalls extending to the bottom surface. The recessed section is configured to be filled with a solid form of a metal or metal alloy that provides a printing surface for forming a 3D object in a 3D printing device. The recessed section includes a locking mechanism configured to prevent lift-up of the solid form of the metal or metal alloy during 3D printing in the 3D printing device.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Inventors: David P. Socha, Mark K. Olearczyk
  • Patent number: 12023735
    Abstract: Some implementations of the disclosure are directed to an additive manufacturing build plate structure for metal build surface stabilization during 3D printing and facile release of 3D printed objects. The build plate includes a body having a recessed section formed through a first surface of the body, the recessed section including a bottom surface within the body and sidewalls extending to the bottom surface. The recessed section is configured to be filled with a solid form of a metal or metal alloy that provides a printing surface for forming a 3D object in a 3D printing device. The recessed section includes a locking mechanism configured to prevent lift-up of the solid form of the metal or metal alloy during 3D printing in the 3D printing device.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: July 2, 2024
    Assignee: INDIUM CORPORATION
    Inventors: David P. Socha, Mark K. Olearczyk
  • Publication number: 20230302541
    Abstract: Some implementations of the disclosure are directed to an additive manufacturing build plate structure for metal build surface stabilization during 3D printing and facile release of 3D printed objects. The build plate includes a body having a recessed section formed through a first surface of the body, the recessed section including a bottom surface within the body and sidewalls extending to the bottom surface. The recessed section is configured to be filled with a solid form of a metal or metal alloy that provides a printing surface for forming a 3D object in a 3D printing device. The recessed section includes a locking mechanism configured to prevent lift-up of the solid form of the metal or metal alloy during 3D printing in the 3D printing device.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 28, 2023
    Inventors: David P. Socha, Mark K. Olearczyk
  • Publication number: 20220266344
    Abstract: Thermally decomposable build plates that enable the facile release of 3D printed parts are described. In one implementation, an additive manufacturing build plate comprises: a body including a top surface, a bottom surface, and sidewalls dimensioned such that the build plate is useable in a 3D printing device; and a layer of a solid metal or metal alloy on the top surface of the additive manufacturing build plate, the layer having a solidus temperature that is lower than a solidus temperature of the body, and the layer configured to provide a surface for forming a 3D object in the 3D printing device. In one implementation, an additive manufacturing build plate comprises a recessed section for receiving an insert including a layer of a solid metal or metal alloy on a surface of the insert.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 25, 2022
    Inventors: David P. Socha, Mark K. Olearczyk