Patents by Inventor Mark Kapeckas

Mark Kapeckas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Analysis method
    Publication number: 20060151327
    Abstract: Analytical methods are disclosed for determining the quantity of organic components in a bath. The analytical methods work over a broad concentration range of organic components and are sensitive in measuring organic bath components at low concentrations.
    Type: Application
    Filed: April 24, 2004
    Publication date: July 13, 2006
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Reverse pulse plating composition and method
    Publication number: 20060081475
    Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
    Type: Application
    Filed: November 30, 2005
    Publication date: April 20, 2006
    Applicant: Shipley Company, L.L.C.
    Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg
  • Plating bath and method for depositing a metal layer on a substrate
    Publication number: 20050155866
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 21, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: David Gabe, Andrew Cobley, Leon Barstad, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Plating bath and method for depositing a metal layer on a substrate
    Publication number: 20050139118
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 30, 2005
    Applicant: SHIPLEY COMPANY, L.L.C.
    Inventors: Andrew Cobley, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Leon Barstad, Thomas Buckley
  • Bath analysis
    Publication number: 20050016856
    Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
    Type: Application
    Filed: April 24, 2004
    Publication date: January 27, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Reverse pulse plating composition and method
    Publication number: 20050016858
    Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
    Type: Application
    Filed: December 19, 2003
    Publication date: January 27, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg