Patents by Inventor MARK KAPPEL

MARK KAPPEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ASSEMBLY AND THERMAL MANAGEMENT OF CT DETECTOR ELECTRONICS CIRCUITS
    Publication number: 20070098137
    Abstract: Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.
    Type: Application
    Filed: November 3, 2005
    Publication date: May 3, 2007
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: ASHUTOSH JOSHI, JOE LACEY, MARK KAPPEL, MAYANK GUPTA