Patents by Inventor Mark Konarski

Mark Konarski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable encapsulants and use thereof
    Patent number: 10141532
    Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: November 27, 2018
    Assignees: HENKEL IP & HOLDING GMBH, HENKEL AG & CO. KGAA
    Inventors: Yuxia Liu, Mark Konarski, Charles W. Paul, Peter D. Palasz
  • CURABLE ENCAPSULANTS AND USE THEREOF
    Publication number: 20170244058
    Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
    Type: Application
    Filed: May 9, 2017
    Publication date: August 24, 2017
    Inventors: Yuxia LIU, Mark KONARSKI, Charles W. PAUL, Peter D. PALASZ
  • Curable encapsulants and use thereof
    Patent number: 9676928
    Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: June 13, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuxia Liu, Mark Konarski, Charles W. Paul, Peter D. Palasz
  • CURABLE ENCAPSULANTS AND USE THEREOF
    Publication number: 20150056757
    Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 26, 2015
    Inventors: Yuxia Liu, Mark Konarski, Charles W. Paul, Peter D. Palasz
  • Photoinitiated Cationic Epoxy Compositions
    Publication number: 20070267134
    Abstract: The present invention is directed to photoinitiated cationic epoxy compositions, which show a delayed onset of cure resulting in controllable “open times” for the end user consumer. These compositions are activated by exposure to electromagnetic radiation, such as UV radiation with a wavelength In the range of 254-405 nm, but show a commercially meaningful “open time” and then cure even in shaded zones to achieve a desired final adhesive strength.
    Type: Application
    Filed: September 2, 2005
    Publication date: November 22, 2007
    Inventors: Mark Konarski, Susan Levandoski
  • Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions
    Publication number: 20070138411
    Abstract: The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.
    Type: Application
    Filed: December 19, 2005
    Publication date: June 21, 2007
    Inventors: Mark Konarski, Edwin Perez, Eerik Maandi, Vic Kadziela, Steven Hemsen, Ronald Belek