Patents by Inventor Mark Krier

Mark Krier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8179323
    Abstract: A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: May 15, 2012
    Assignee: Ethertronics, Inc.
    Inventors: Jeffrey Shamblin, Laurent Desclos, Mark Krier
  • Patent number: 8059047
    Abstract: A capacitively loaded magnetic dipole antenna is provided with a portion that comprises a length that is longer than a straight line distance between a first end and a second end of the third portion such that antenna with a tower profile and/or smaller form factor is achieved.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: November 15, 2011
    Assignee: Ethertronics, Inc.
    Inventors: Laurent Desclos, Mark Krier, Shane Thornwall, Vaneet Pathak, Gregory Poilasne, Sebastian Rowson
  • Publication number: 20100033394
    Abstract: A capacitively coupled dipole antenna is coupled to a substrate such that a capacitative portion of the antenna spans a void in the substrate.
    Type: Application
    Filed: September 30, 2009
    Publication date: February 11, 2010
    Inventors: Mark Krier, Shane Thornwall, Sebastian Rowson, Laurent Desclos
  • Patent number: 7616164
    Abstract: A capacitively coupled dipole antenna is coupled to a substrate such that a capacitative portion of the antenna spans a void in the substrate.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: November 10, 2009
    Assignee: ETHERTRONICS, Inc.
    Inventors: Mark Krier, Shane Thornwall, Sebastian Rowson, Laurent Desclos
  • Publication number: 20090231206
    Abstract: A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.
    Type: Application
    Filed: December 18, 2008
    Publication date: September 17, 2009
    Applicant: Ethertronics, Inc.
    Inventors: Jeffrey Shamblin, Laurent Desclos, Mark Krier
  • Publication number: 20040169613
    Abstract: A capacitively coupled dipole antenna is coupled to a substrate such that a capacitative portion of the antenna spans a void in the substrate.
    Type: Application
    Filed: August 18, 2003
    Publication date: September 2, 2004
    Inventors: Mark Krier, Shane Thornwall, Sebastian Rowson, Laurent Desclos
  • Publication number: 20040169614
    Abstract: A capacitively loaded magnetic dipole antenna is provided with a portion that comprises a length that is longer than a straight line distance between a first end and a second end of the third portion such that antenna with a tower profile and/or smaller form factor is achieved.
    Type: Application
    Filed: February 27, 2003
    Publication date: September 2, 2004
    Inventors: Laurent Desclos, Mark Krier, Shane Thornwall, Vaneet Pathak, Gregory Poilasne, Sebastian Rowson