Patents by Inventor Mark Kuhlman

Mark Kuhlman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package comprising a solder resist layer configured as a seating plane for a device
    Patent number: 11626336
    Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: April 11, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Daniel Garcia, Kinfegebriel Amera Mengistie, Francesco Carrara, Chang-Ho Lee, Ashish Alawani, Mark Kuhlman, John Jong-Hoon Lee, Jeongkeun Kim, Xiaoju Yu, Supatta Niramarnkarn
  • PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PLANE FOR A DEVICE
    Publication number: 20210098320
    Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 1, 2021
    Inventors: Daniel GARCIA, Kinfegebriel Amera MENGISTIE, Francesco CARRARA, Chang-Ho LEE, Ashish ALAWANI, Mark KUHLMAN, John Jong-Hoon LEE, Jeongkeun KIM, Xiaoju YU, Supatta NIRAMARNKARN
  • Self-shielded die having electromagnetic shielding on die surfaces
    Patent number: 9922937
    Abstract: A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.
    Type: Grant
    Filed: July 30, 2016
    Date of Patent: March 20, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Mark Kuhlman
  • SELF-SHIELDED DIE HAVING ELECTROMAGNETIC SHIELDING ON DIE SURFACES
    Publication number: 20180033737
    Abstract: A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.
    Type: Application
    Filed: July 30, 2016
    Publication date: February 1, 2018
    Inventor: Mark Kuhlman