Patents by Inventor Mark Kuzawinski

Mark Kuzawinski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating tail design for IC packages
    Publication number: 20050051879
    Abstract: A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.
    Type: Application
    Filed: October 19, 2004
    Publication date: March 10, 2005
    Applicant: International Business Machines Corporation
    Inventors: Mark Kuzawinski, Edward Wolf
  • Integrated circuit package with overlapping bond fingers
    Publication number: 20050029649
    Abstract: An integrated circuit package comprises a set of bond fingers for connecting wire bonds from the chip, the bond fingers being placed overlapping on a transverse axis from the chip and extending inwardly and outwardly from vias positioned at different positions along the transverse axis, so that wire bonds connected to adjacent fingers have the same length.
    Type: Application
    Filed: August 5, 2003
    Publication date: February 10, 2005
    Inventors: Mark Kuzawinski, Edward Wolf