Patents by Inventor Mark L. Hadzor

Mark L. Hadzor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6784043
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: August 31, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Patent number: 6642084
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: November 4, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Publication number: 20030128615
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Application
    Filed: February 14, 2003
    Publication date: July 10, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Patent number: 6522595
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: February 18, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Publication number: 20020122342
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Application
    Filed: April 19, 2002
    Publication date: September 5, 2002
    Applicant: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Publication number: 20010000992
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Application
    Filed: January 5, 2001
    Publication date: May 10, 2001
    Applicant: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey
  • Patent number: 6172929
    Abstract: An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: January 9, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Bryan C. Carson, Mark L. Hadzor, Lucien J. Bissey