Abstract: A control valve assembly (94) is provided for allowing manual and automatic splitter shifting in a compound splitter-type vehicular transmission system (92). The control valve assembly is interposed in series between a selectively pressurized and exhausted conduit (108) controlled by a manual selector valve (104) and a pilot conduit (110) controlling the operation of a splitter shift actuator (86). The control valve assembly is designed to fail in a position allowing fluid communication between the selectively pressurized and exhausted conduit and the pilot conduit.

Abstract: A shift yoke (10) defining contact pads (18, 20) for axially engaging contact surfaces (22) on a relatively rotating clutch member (12). Inlet ramps (34, 36) are provided at the upstream ends of the contact pads to provide an inlet (36) for directing lubricant between the axially engaging surfaces.

Abstract: A transmission shifting mechanism (10) and position sensor assembly. The shifting mechanism includes a member (32) of known flux-conducting or flux-insulating properties movable therewith, which will variably extend (42, 44, 46) into an electric coil (36), which is periodically charged and then allowed to discharge. The rate of discharge is variable with the position of the member in the coil and, thus, provides a signal indicative to mechanism condition (H, N, L).

Abstract: A ground strap and vibration mount assembly (10) effectively mechanically isolates an electronic component from vibration while also providing an electrically conductive path to ground potential. The assembly (10) includes a vibration dampener (16) mounted through an opening (28) formed in a tab (12) projecting from the housing of the vibration sensitive electronic component. An insert (18) is provided therein and a mounting bolt (54) is positioned through a suitable opening (36) formed through the insert (18). An electrically conductive ground strap (40) is wrapped partially around the tab (12). An aperture (52) is formed in one portion (50) of the strap (40) and the bolt (54) passed therethrough. Opposing ends (42) of the electrically conductive connector (40) are secured to the tab (12).

Abstract: A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.

Abstract: An X-Y shifting mechanism (25) is disclosed for controlling the shifting of a shift rail (17) in a first (Y-Y) transverse direction. The mechanism includes a shift finger assembly (39) including a shift finger (23). A lever member (57) is pivotable about the axis (A) of rotation. When the lever member (57) is pivoted, the movement is transmitted through a spring (91) to rotate a spring seat member (73), thus causing pivotal movement of the shift finger (23). During a non-synchronous engagement, kick-out movement causes pivotal movement of the shift finger in the opposite direction, compressing the spring (91) rather than damaging the shifting mechanism. The disclosed mechanism also enables preselection of neutral, compressing the appropriate one of the springs (91), such that the preloaded spring will move the shift finger and shift rail to the neutral position as soon as a torque break occurs.

Abstract: Apparatus is provided for isolating a sensor from a vibrating surface. The sensor has first and second spaced surfaces, a bore extending between the surfaces and a groove in the second surface. The apparatus includes a flanged sleeve adapted to extend through the bore to the vibrating surface. The sleeve is sufficiently long when extending through the bore to provide a first gap between the vibrating surface and the second surface of the sensor and sufficiently narrow when extending through the bore to provide a second gap between the sleeve and the sensor. The flange overlays the first surface of the sensor and the second gap. The apparatus also includes a bolt, which extends through the bore and into engagement with the vibrating surface, for attaching the sleeve to the vibrating surface. The apparatus also includes a first O-ring positioned between the first surface of the sensor and the sleeve flange and a second O-ring positioned in the groove of the second surface.

Abstract: A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.