Abstract: Embodiments of the system and methods disclosed herein reduce the amount of handling necessary to organize the IC packages and thus may be utilized to increase the throughput of a test handler. To organize the IC packages, the IC packages may be initially placed on a first IC tray by the test handler. All of the IC packages are tested from the first IC tray so as to generate operational state data items for the IC packages. After all of the IC packages on the first IC tray are tested, the IC packages are sorted based on the operational state data items. In this manner, the operational state data items of the IC packages are known before sorting and thus not every IC package needs to be picked and placed in order to organize the IC packages.

Abstract: Embodiments of the system and methods disclosed herein reduce the amount of handling necessary to organize the IC packages and thus may be utilized to increase the throughput of a test handler. To organize the IC packages, the IC packages may be initially placed on a first IC tray by the test handler. All of the IC packages are tested from the first IC tray so as to generate operational state data items for the IC packages. After all of the IC packages on the first IC tray are tested, the IC packages are sorted based on the operational state data items. In this manner, the operational state data items of the IC packages are known before sorting and thus not every IC package needs to be picked and placed in order to organize the IC packages.

Abstract: A test fixture for an electronic device is provided that removes debris from a socket of the test fixture using back side air blow off. In general, the test fixture includes a circuit board, a socket on a front side of the circuit board, and an air manifold on a back side of the circuit board. Pressurized air is provided to the air manifold through an air supply inlet coupling the air manifold to an external pressurized air supply. At least one via formed through the circuit board fluidly couples the air manifold on the back side of the circuit board to the socket on the front side of the circuit board. Accordingly, the pressurized air from the air manifold flows through the vias and up through the socket such that debris is removed from the socket.