Patents by Inventor Mark Lee Humphrey
Mark Lee Humphrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12049022Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.Type: GrantFiled: September 8, 2023Date of Patent: July 30, 2024Assignee: Corning IncorporatedInventors: Samir Biswas, Memduh Volkan Demirbas, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller
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Publication number: 20230415374Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.Type: ApplicationFiled: September 8, 2023Publication date: December 28, 2023Inventors: Samir Biswas, Memduh Volkan Demirbas, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller
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Patent number: 11833604Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.Type: GrantFiled: May 21, 2020Date of Patent: December 5, 2023Assignee: Corning IncorporatedInventors: Timothy Eugene Antesberger, Dana Craig Bookbinder, Dana Eugene Coots, Seyed Amir Farzadfar, Dominick John Forenz, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller, Richard Curwood Peterson, John Charles Rector
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Patent number: 11780115Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.Type: GrantFiled: November 24, 2020Date of Patent: October 10, 2023Assignee: Corning IncorporatedInventors: Samir Biswas, Memduh Volkan Demirbas, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller
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Publication number: 20220234108Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.Type: ApplicationFiled: May 21, 2020Publication date: July 28, 2022Inventors: Timothy Eugene Antesberger, Dana Craig Bookbinder, Dana Eugene Coots, Seyed Amir Farzadfar, Dominick John Forenz, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller, Richard Curwood Peterson, John Charles Rector
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Publication number: 20210154885Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.Type: ApplicationFiled: November 24, 2020Publication date: May 27, 2021Inventors: Samir Biswas, Memduh Volkan Demirbas, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller
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Patent number: 10730125Abstract: An apparatus and method to machine cavities in die blanks having little to no taper. The apparatus includes an electrode tool (200) including intersecting walls coated with electrically insulating coating (258), an erosion face (204) comprising a cross section of the walls exposed through the electrically insulating coating, and a channel formed by the walls to supply electrolyte to the erosion face, the channels defined by interior surfaces of the walls and having an opening formed by edges of the erosion face. The method includes pulsed electrochemical machining a work piece with the electrode tool.Type: GrantFiled: November 20, 2015Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventors: Dominick John Forenz, Mark Lee Humphrey, Kenneth Richard Miller, John Charles Rector, Gregg Lee Shugars
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Patent number: 10549401Abstract: A method of shaping a laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer is provided. The method includes cutting the laminated glass structure with an abrasive cutting jet including a pressurized cutting fluid and abrasive particles thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.Type: GrantFiled: April 29, 2015Date of Patent: February 4, 2020Assignee: CORNING INCORPORATEDInventors: Dominick John Forenz, Mark Lee Humphrey, Walter Jay McKendrick, Michael William Price, Gregg Lee Shugars
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Publication number: 20180154493Abstract: A method of finishing a laminated glass structure (102) comprising a flexible glass sheet (130) having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate (116) by an adhesive layer (135) is provided. The method includes applying a compressive force against a cut edge (106) of the flexible glass sheet (130) using an abrasive surface (108) of a hand-held finishing tool (105). Material of the laminated glass structure (102) is removed at the cut edge (106) such that a glass edge strength of the flexible glass sheet (130) is at least about 50 MPa.Type: ApplicationFiled: April 22, 2016Publication date: June 7, 2018Applicant: Corning IncorporatedInventors: DOMINICK JOHN FORENZ, TIMOTHY DESMOND HARSH, MARK LEE HUMPHREY, MICHAEL WILLIAM PRICE, ERIC JOSEPH TEATOR, PETER JOSEPH WEBSTER
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Publication number: 20170266743Abstract: An apparatus and method to machine cavities in die blanks having little to no taper. The apparatus includes an elec trode tool (200) including intersecting walls coated with electrically insulating coating (258), an erosion face (204) comprising a cross section of the walls exposed through the electrically insulating coating, and a channel formed by the walls to supply electrolyte to the erosion face, the channels defined by interior surfaces of the walls and having an opening formed by edges of the erosion face. The method includes pulsed electrochemical machining a work piece with the electrode tool.Type: ApplicationFiled: November 20, 2015Publication date: September 21, 2017Applicant: Corning IncorporatedInventors: Dominick John Forenz, Mark Lee Humphrey, Kenneth Richard Miller, John Charles Rector, Gregg Lee Shugars
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Patent number: 9676045Abstract: Electrodes, components, apparatuses, and methods for electrochemical machining (ECM) are disclosed. ECM may be employed to provide burr-free or substantially burr-free ECM of electrically-conductive workpieces (e.g. shrouds). As one non-limiting example, the electrically-conductive workpiece may be a shroud that is used as an electrical component in electronics boards. While the ECM components, apparatuses, and methods disclosed herein reduce burrs, ECM can provide imprecise machining and cause stray erosions to occur in the machined electrically-conductive workpiece. In this regard, the electrodes, components, apparatuses, and methods for ECM disclosed herein provide features that allow for precise machining of the machined electrically-conductive workpiece and also allow avoidance of stray erosions in the machined electrically-conductive workpiece.Type: GrantFiled: February 27, 2012Date of Patent: June 13, 2017Assignee: Corning Optical Communications RF LLCInventors: Terry George Collins, Dominick John Forenz, Mark Lee Humphrey
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Publication number: 20170120420Abstract: A method of shaping a laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer is provided. The method includes cutting the laminated glass structure with an abrasive cutting jet including a pressurized cutting fluid and abrasive particles thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.Type: ApplicationFiled: April 29, 2015Publication date: May 4, 2017Applicant: Corning IncorporatedInventors: Dominick John FORENZ, Mark Lee HUMPHREY, Walter Jay MCKENDRICK, Michael William PRICE, Gregg Lee SHUGARS
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Patent number: 8263895Abstract: An electrode for machining a pattern in a workpiece has a conductive body with a lattice of closed cells and a plurality of open cells. The open cells are positioned at an edge of the lattice of closed cells. The closed cells are defined by interconnected webs, and the open cells are defined by fins extending from the interconnected webs. A thickness of the fins is less than a thickness of the webs. In use, the electrode is positioned at a plurality of locations on the workpiece, such that a position of the fins of the electrode at each location overlaps a position of the fins of the electrode at an adjacent location. The pattern is formed at each of the plurality of locations by passing electrical charges repeatedly between the electrode and the workpiece and advancing the electrode into the workpiece.Type: GrantFiled: August 28, 2009Date of Patent: September 11, 2012Assignee: Corning IncorporatedInventor: Mark Lee Humphrey
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Publication number: 20120217163Abstract: Electrodes, components, apparatuses, and methods for electrochemical machining (ECM) are disclosed. ECM may be employed to provide burr-free or substantially burr-free ECM of electrically-conductive workpieces (e.g. shrouds). As one non-limiting example, the electrically-conductive workpiece may be a shroud that is used as an electrical component in electronics boards. While the ECM components, apparatuses, and methods disclosed herein reduce burrs, ECM can provide imprecise machining and cause stray erosions to occur in the machined electrically-conductive workpiece. In this regard, the electrodes, components, apparatuses, and methods for ECM disclosed herein provide features that allow for precise machining of the machined electrically-conductive workpiece and also allow avoidance of stray erosions in the machined electrically-conductive workpiece.Type: ApplicationFiled: February 27, 2012Publication date: August 30, 2012Inventors: Terry George Collins, Dominick John Forenz, Mark Lee Humphrey
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Patent number: 8244497Abstract: Methods are provided for solving a process function for modification of a non-test die for use in extrusion of a honeycomb body. The process function is solved by comparing measured widths of a plurality of slots between pins of a test die in the post-removal state and measured widths of a plurality of slots between pins of the test die in the pre-removal state. Methods are also provided for modifying a non-test die for use in extrusion of a honeycomb body. Such methods remove non-test-die material from a plurality of pins of the non-test die based on application of the process function.Type: GrantFiled: May 29, 2009Date of Patent: August 14, 2012Assignee: Corning IncorporatedInventors: David William Folmar, Mark Lee Humphrey, Shane David Seyler
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Patent number: 8232205Abstract: Methods of manufacturing a honeycomb extrusion die comprise the steps of coating at least a portion of a die body with a layer of conductive material and modifying the die body with an electrical discharge machining technique. The method then further includes the step of chemically removing the layer of conductive material, wherein the residual material from the electrical discharge machining technique is released from the die body.Type: GrantFiled: August 25, 2009Date of Patent: July 31, 2012Assignee: Corning IncorporatedInventor: Mark Lee Humphrey
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Patent number: 8138441Abstract: A method of machining a pattern at a plurality of locations in a workpiece includes positioning a shaped electrode including the pattern at the plurality of locations in a sequence. In some embodiments, the sequence is random. The method further includes forming the pattern at each of the plurality of locations by passing electrical charges repeatedly between the shaped electrode and the workpiece and advancing the shaped electrode into the workpiece for a fraction of a full depth of the pattern. The method further includes repeating the positioning and forming steps a plurality of times until the full depth of the pattern has been formed at each of the plurality of locations.Type: GrantFiled: December 21, 2007Date of Patent: March 20, 2012Assignee: Corning IncorporatedInventors: Dominick John Forenz, Mark Lee Humphrey, Bruce Edwin Klingensmith, Jr.
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Publication number: 20110206896Abstract: An extrusion die and method for manufacturing an extrusion die for producing a honeycomb body. The honeycomb body includes a plurality of channels defined by intersecting internal walls. The channels have non-equal cross-sectional sizes arranged in an alternating pattern. The channels are divided into a first region including at least one row of channels adjacent an outer peripheral wall of the body, and a second region including remaining channels. The internal walls in the first region have a thickness that increases along an axis extending to the outer peripheral wall.Type: ApplicationFiled: February 25, 2010Publication date: August 25, 2011Inventors: Mark Lee Humphrey, James Willis Suggs, JR.
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Publication number: 20110049107Abstract: An electrode for machining a pattern in a workpiece has a conductive body with a lattice of closed cells and a plurality of open cells. The open cells are positioned at an edge of the lattice of closed cells. The closed cells are defined by interconnected webs, and the open cells are defined by fins extending from the interconnected webs. A thickness of the fins is less than a thickness of the webs. In use, the electrode is positioned at a plurality of locations on the workpiece, such that a position of the fins of the electrode at each location overlaps a position of the fins of the electrode at an adjacent location. The pattern is formed at each of the plurality of locations by passing electrical charges repeatedly between the electrode and the workpiece and advancing the electrode into the workpiece.Type: ApplicationFiled: August 28, 2009Publication date: March 3, 2011Inventor: Mark Lee Humphrey
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Publication number: 20110049103Abstract: Methods of manufacturing a honeycomb extrusion die comprise the steps of coating at least a portion of a die body with a layer of conductive material and modifying the die body with an electrical discharge machining technique. The method then further includes the step of chemically removing the layer of conductive material, wherein the residual material from the electrical discharge machining technique is released from the die body.Type: ApplicationFiled: August 25, 2009Publication date: March 3, 2011Inventor: Mark Lee Humphrey