Patents by Inventor Mark Lefebvre

Mark Lefebvre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR PROVIDING SYNTHETIC DATA
    Publication number: 20240330404
    Abstract: Systems, methods, and apparatuses implementing a synthetic data generation system are provided herein. In some embodiments, an example synthetic data generation system may be configured to generate high-quality synthetic data that can be used for data analysis operations and/or generate one or more predictive outputs.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Inventor: Mark Lefebvre
  • Indium electroplating compositions containing amine compounds and methods of electroplating indium
    Patent number: 10428436
    Abstract: Indium electroplating compositions containing amine compounds in trace amounts to electroplate substantially defect-free uniform indium which has a smooth surface morphology. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: October 1, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yi Qin, Kristen Flajslik, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
    Patent number: 10104782
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
    Patent number: 10100421
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
    Patent number: 10006136
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 26, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
    Patent number: 9932684
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 3, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM
    Publication number: 20180016689
    Abstract: Indium electroplating compositions electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
    Type: Application
    Filed: July 18, 2016
    Publication date: January 18, 2018
    Inventors: Yi Qin, Kristen Flajslik, Mark Lefebvre
  • INDIUM ELECTROPLATING COMPOSITIONS CONTAINING 2-IMIDAZOLIDINETHIONE COMPOUNDS AND METHODS FOR ELECTROPLATING INDIUM
    Publication number: 20180016690
    Abstract: Indium electroplating compositions containing 2-imidazolidinethione compounds electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
    Type: Application
    Filed: May 12, 2017
    Publication date: January 18, 2018
    Inventors: Yi Qin, Kristen Flajslik, Mark Lefebvre
  • INDIUM ELECTROPLATING COMPOSITIONS CONTAINING AMINE COMPOUNDS AND METHODS OF ELECTROPLATING INDIUM
    Publication number: 20180016691
    Abstract: Indium electroplating compositions containing amine compounds in trace amounts to electroplate substantially defect-free uniform indium which has a smooth surface morphology. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
    Type: Application
    Filed: May 12, 2017
    Publication date: January 18, 2018
    Inventors: Yi Qin, Kristen Flajslik, Mark Lefebvre
  • Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
    Patent number: 9809892
    Abstract: Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yi Qin, Kristen Flajslik, Mark Lefebvre
  • Plating method
    Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • METHOD OF ELECTROPLATING LOW INTERNAL STRESS COPPER DEPOSITS ON THIN FILM SUBSTRATES TO INHIBIT WARPING
    Publication number: 20170145577
    Abstract: Thin film substrates are electroplated with copper from low internal stress, high ductility acid copper electroplating baths. During the copper electroplating process the thin film substrates can warp or bow. To address the problem of warping or bowing during copper electroplating the thin film substrate is held by a securing means which inhibits the thin film substrate from excessive activity.
    Type: Application
    Filed: October 17, 2016
    Publication date: May 25, 2017
    Inventors: Yu Hua Kao, Lingyun Wei, Luis Gomez, Mark Lefebvre
  • ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS
    Publication number: 20170067173
    Abstract: Acid copper electroplating baths provide improved low internal stress copper deposits with good ductility. The acid copper electroplating baths include one or more polyallylamines and certain sulfur containing accelerators. The acid copper electroplating baths may be used to electroplate thin films on relatively thin substrates to provide thin film copper deposits having low internal stress and high ductility.
    Type: Application
    Filed: August 16, 2016
    Publication date: March 9, 2017
    Inventors: Lingyun Wei, Yu Hua Kao, Rebecca Hazebrouck, Robert Corona, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS
    Publication number: 20170037526
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES
    Publication number: 20170042037
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
    Publication number: 20170037527
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE COMPOUNDS, BISEPOXIDES AND HALOBENZYL COMPOUNDS
    Publication number: 20170037528
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTIILITY COPPER DEPOSITS
    Publication number: 20160312372
    Abstract: Acid copper electroplating baths provide improved low internal stress copper deposits with good ductility. The acid copper electroplating baths include one or more branched polyalkylenimines and one or more accelerators. The acid copper electroplating baths may be used to electroplate thin films on relatively thin substrates to provide thin film copper deposits having low internal stress and high ductility.
    Type: Application
    Filed: April 27, 2015
    Publication date: October 27, 2016
    Inventors: Lingyun WEI, Rebecca HAZEBROUCK, Bryan LIEB, Yu-Hua KAO, Mark LEFEBVRE, Robert A. CORONA
  • Method of electroplating uniform copper layers
    Patent number: 9365943
    Abstract: Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: June 14, 2016
    Inventors: Elie H. Najjar, Mark Lefebvre, Leon R. Barstad, Michael P. Toben
  • FLOATATION ACCESSORY DEVICE FOR AN E-READING DEVICE
    Publication number: 20160121977
    Abstract: A floatation accessory device is provided for an e-reading device.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventor: Mark Lefebvre