Patents by Inventor Mark Lentz

Mark Lentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5567181
    Abstract: A low profile electrical plug includes a support plate formed from a rigid, nonconductive material such as a printed circuit board. Prongs extend perpendicularly from a face of the support plate and are oriented for insertion into a conventional electrical outlet. The prongs are adapted to snap into reciprocal apertures in the support plate during assembly. Paths of electrically conductive material are disposed on a face of the support plate and extend between the prongs and terminals formed in the edge of the support plate. A power cord has electrical conductors electrically connected to different ones of the prongs to provide an electrical connection to a remote device. For this purpose, each power cord conductor includes a connector adapted slide over one of the terminals and electrically contact a respective conductive path. The integral assembly of the power cord, support plate and prongs is molded in a nonconductive housing.
    Type: Grant
    Filed: May 8, 1995
    Date of Patent: October 22, 1996
    Assignee: Woods Industries, Inc.
    Inventors: Mark Lentz, Steven R. Moses, Eloy F. Pettiford, Craig Stewart, Douglas D. Wright
  • Patent number: 5474074
    Abstract: An ultrasonic transducer includes a transducer element having a backing element bonded thereto. The thickness of the backing element is selected to be less than or equal to half the length of an ultrasonic pulse, expressed in wavelengths of the center frequency of the pulse, so that the first reflection from the back side of the backing element is received by the transducer element before the primary pulse rings down. A method for mounting the transducer that reduces the formation of air bubbles includes the steps of forming a peaked mound and continually lowering the transducer to flatten the mound against the underside of the transducer.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: December 12, 1995
    Assignee: Cardiovascular Imaging Systems, Incorporated
    Inventors: Veijo Suorsa, Peter Thornton, Mark Lentz
  • Patent number: D354941
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: January 31, 1995
    Assignee: Woods Industries, Inc.
    Inventors: Mark Lentz, Craig Stewart