Patents by Inventor Mark Leonov
Mark Leonov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5507614Abstract: A holder mechanism tilts and rotates a vertically oriented wafer-loaded cassette for proper presentation in a horizontal orientation to the robotic arm of a workstation. The mechanism includes a cassette holder, a support member, and a motor. The cassette holder has first and second supports that define orthogonal first and second planes. In two embodiments, the support member connects the cassette holder to the motor shaft and, as the motor shaft rotates, the cassette holder is rotated about a single pivot axis that is oblique to the first and second planes. This rotation tilts a cassette placed in the holder through a tilt angle of about 45.degree. to 90.degree., and simultaneous rotates the cassette through an angle .theta. about the vertical axis. The support member shape determines whether tilting and rotation is away from or toward the motor, and also determines the angle of rotation .theta. and the tilt angle.Type: GrantFiled: March 2, 1995Date of Patent: April 16, 1996Assignee: Cybeq SystemsInventors: Mark Leonov, Emile N. Kerba, Jack Aknin
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Patent number: 5115842Abstract: An apparatus for delivery of a liquid. The apparatus includes a housing and a cradle for holding a container containing the liquid. The cradle is rotatably coupled to the housing. The cradle is rotatable between a first position and a second position. The apparatus further includes a reservoir for receiving the liquid from the container. The reservoir is coupled to the cradle and rotates with the cradle. The reservoir includes a passageway through which the liquid is able to flow downward for all positions the cradle is permitted to rotate to. The reservoir includes a cylinder for minimizing back flow of the liquid from the reservoir to the container. The reservoir also includes a first orifice for allowing the liquid to pass out of the reservoir, a second orifice for allowing an air bubble in the liquid to return to the reservoir, and a check valve for allowing air to pass into the reservoir.Type: GrantFiled: August 30, 1990Date of Patent: May 26, 1992Assignee: Intel CorporationInventors: Douglas E. Crafts, Mark A. Leonov
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Patent number: 5048195Abstract: An apparatus for aligning adjacent surfaces for coplanarity and angle is described. The apparatus comprises a base plate, a plurality of support legs coupled to the base plate, a plurality of depth gauges coupled to the base plate, an angle coupled to the base plate, and leveling means coupled to an inclined surface. The inclined surface of the angle plate slopes towards the plurality of depth gauges. The inclined surface has a predetermined angle. A method for aligning first and second adjacent surfaces for coplanarity and relative angle is also described. The alignment apparatus is placed on a flat surface. The apparatus is calibrated so that all of the plurality of depth gauges read a first value. The apparatus is placed on the first and second adjacent process modules such that the support legs rest on the first adjacent process module and the plurality of depth gauges rest on the second adjacent process module.Type: GrantFiled: August 6, 1990Date of Patent: September 17, 1991Assignee: Intel CorporationInventor: Mark A. Leonov
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Patent number: 5035062Abstract: An apparatus for centering semiconductor loading and unloading arms is described. The apparatus comprises a cap and a ring. The cap comprises a first plate, substantially in the shape of an electrode, a lip affixed to the edge of the first plate for holding the first plate stationary in a lateral direction, and a pin affixed to a top of the first plate such that the pin is perpendicular to the first plate. The ring comprises a second plate substantially in the shape of a semiconductor material to be placed on the electrode, an aperture in the second plate, the diameter of the aperture being the same as the diameter of the pin, and a collar surrounding the aperture, wherein the collar is for holding the second plate.Type: GrantFiled: April 6, 1990Date of Patent: July 30, 1991Assignee: Intel CorporationInventors: Mark A. Leonov, Jan A. Kordel
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Patent number: 4976002Abstract: The present invention overcomes the aforementioned difficulties by providing a vacuum device to clean the interior surface of particle tubes used in the manufacture of semiconductor wafers. The vacuum device consists of a head which is designed to closely fit with the interior surface of the particle tube to be cleaned. Guide wheels are provided to align the head with the particle tube and to allow the vacuum device to easily roll in and out of the particle tube. The wheels are made of material which does not scratch the interior surface of the particle tube. The head is attached to vacuum tubing by means of flexible bellows. The vacuum tubing and head may be rotated to allow the head to clean the entire interior surface of the particle tube.Type: GrantFiled: December 2, 1988Date of Patent: December 11, 1990Assignee: Intel CorporationInventors: Mark Leonov, Roy de Groot
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Patent number: 4878376Abstract: A test fixture for sputter targets used in the manufacture of semiconductor devices and a method of testing sputter targets. The test fixture comprises a specially shaped piece of material which is adapted to receive a sputter target. The test fixture generally conforms to the shape of the sputter target. The interface between the test fixture and the sputter target is carefully manufactured so as to maintain an airtight seal. A passageway is disposed within one sidewall of the test fixture. A vacuum tubing is disposed within the passageway and valve is connected to the tubing so that the cavity within the test fixture can be evacuated. The size of the cavity is kept small so that it may be quickly evacuated. The present invention provides an efficient and cost effective method of testing sputter targets prior to their being placed in the sputter machine.Type: GrantFiled: December 27, 1988Date of Patent: November 7, 1989Assignee: Intel CorporationInventors: Mark Leonov, Jan Kordel
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Patent number: 4868992Abstract: The present invention is an anode cathode parallelism gap gauge. The gauge is for determining the relative parallelism between two planar surfaces such as an anode and cathode in a relative ion chamber. The gauge sits on the anode on three points and then has the cathode extended into its volume. The cathode will then contact the measuring arms, of which there must be at least three, that statically latch measurement values onto a scalar device. Thus, the present invention provides a reliable and clean method of determining parallelism and distance between an anode and cathode or other surfaces.Type: GrantFiled: April 22, 1988Date of Patent: September 26, 1989Assignee: Intel CorporationInventors: Douglas E. Crafts, Mark A. Leonov
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Patent number: 4790661Abstract: A cross-mask and cross-mask holder with improved adjustment means. A cross-mask holder allows adjustment of a cross-mask in the x, y and theta directions. The cross-mask may be adjusted in the x and the y directions through use of screws on the side of the holder and may be adjusted in the theta direction by turning a tube which contains the cross-mask. The invention further discloses the use of an umbrella and cover assembly to reduce light source background noise which improves the alignment signal on an oscilloscope during processing of semiconductor wafers in a stepper machine.Type: GrantFiled: September 18, 1987Date of Patent: December 13, 1988Assignee: Intel CorporationInventor: Mark Leonov
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Patent number: 4682396Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.Type: GrantFiled: June 9, 1986Date of Patent: July 28, 1987Assignee: Intel CorporationInventor: Mark Leonov
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Patent number: 4676699Abstract: A device for positioning and proving movement to a semiconductor wafer. A pair of elongated members are attached to either side of a plate which is used during the processing of semiconductor wafers. The members are angled away from the center of the plate at the end which receives the wafer. Angled openings in the members are connected to a gas source which shoots a gas, such as air, from the openings to a assist in propelling the wafer and to prevent the wafer from contacting the member itself. The openings may also be used to introduce different atmospheres to the environment of the wafers during processing.Type: GrantFiled: November 5, 1986Date of Patent: June 30, 1987Assignee: Intel CorporationInventor: Mark Leonov
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Patent number: 4659094Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.Type: GrantFiled: May 3, 1985Date of Patent: April 21, 1987Assignee: Intel CorporationInventor: Mark Leonov