Abstract: A holder mechanism tilts and rotates a vertically oriented wafer-loaded cassette for proper presentation in a horizontal orientation to the robotic arm of a workstation. The mechanism includes a cassette holder, a support member, and a motor. The cassette holder has first and second supports that define orthogonal first and second planes. In two embodiments, the support member connects the cassette holder to the motor shaft and, as the motor shaft rotates, the cassette holder is rotated about a single pivot axis that is oblique to the first and second planes. This rotation tilts a cassette placed in the holder through a tilt angle of about 45.degree. to 90.degree., and simultaneous rotates the cassette through an angle .theta. about the vertical axis. The support member shape determines whether tilting and rotation is away from or toward the motor, and also determines the angle of rotation .theta. and the tilt angle.

Abstract: The present invention overcomes the aforementioned difficulties by providing a vacuum device to clean the interior surface of particle tubes used in the manufacture of semiconductor wafers. The vacuum device consists of a head which is designed to closely fit with the interior surface of the particle tube to be cleaned. Guide wheels are provided to align the head with the particle tube and to allow the vacuum device to easily roll in and out of the particle tube. The wheels are made of material which does not scratch the interior surface of the particle tube. The head is attached to vacuum tubing by means of flexible bellows. The vacuum tubing and head may be rotated to allow the head to clean the entire interior surface of the particle tube.

Abstract: A test fixture for sputter targets used in the manufacture of semiconductor devices and a method of testing sputter targets. The test fixture comprises a specially shaped piece of material which is adapted to receive a sputter target. The test fixture generally conforms to the shape of the sputter target. The interface between the test fixture and the sputter target is carefully manufactured so as to maintain an airtight seal. A passageway is disposed within one sidewall of the test fixture. A vacuum tubing is disposed within the passageway and valve is connected to the tubing so that the cavity within the test fixture can be evacuated. The size of the cavity is kept small so that it may be quickly evacuated. The present invention provides an efficient and cost effective method of testing sputter targets prior to their being placed in the sputter machine.

Abstract: A cross-mask and cross-mask holder with improved adjustment means. A cross-mask holder allows adjustment of a cross-mask in the x, y and theta directions. The cross-mask may be adjusted in the x and the y directions through use of screws on the side of the holder and may be adjusted in the theta direction by turning a tube which contains the cross-mask. The invention further discloses the use of an umbrella and cover assembly to reduce light source background noise which improves the alignment signal on an oscilloscope during processing of semiconductor wafers in a stepper machine.

Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

Abstract: A device for positioning and proving movement to a semiconductor wafer. A pair of elongated members are attached to either side of a plate which is used during the processing of semiconductor wafers. The members are angled away from the center of the plate at the end which receives the wafer. Angled openings in the members are connected to a gas source which shoots a gas, such as air, from the openings to a assist in propelling the wafer and to prevent the wafer from contacting the member itself. The openings may also be used to introduce different atmospheres to the environment of the wafers during processing.

Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.