Abstract: A pinch valve assembly includes a valve body having a slot which is configured to allow a web of substrate material to pass therethrough. The valve body has a sealing surface which includes a first curved portion with a first radius of curvature. A dynamic seal element is configured to engage the valve body and includes a second curved portion having a second radius of curvature which is larger than the first radius of curvature. An actuator is operable to selectively bias the dynamic seal element into and out of engagement with the valve body so that when it is biased into engagement with the valve body the web of substrate material is engaged between the sealing surfaces of the dynamic seal element and the valve body. Also disclosed are deposition systems which include these pinch valves.

Abstract: A pinch valve includes a valve body having a slot which is configured to allow a web of substrate material to pass therethrough. The valve body has a sealing surface which includes a first curved portion with a first radius of curvature. A dynamic seal element is configured to engage the valve body and includes a second curved portion having a second radius of curvature which is larger than the first radius of curvature. An actuator is operable to selectively bias the dynamic seal element into and out of engagement with the valve body so that when it is biased into engagement with the valve body the web of substrate material is engaged between the sealing surfaces of the dynamic seal element and the valve body. Also disclosed is a processing system which includes the pinch valve.

Abstract: A pinch valve includes a valve body having a slot which is configured to allow a web of substrate material to pass therethrough. The valve body has a sealing surface which includes a first curved portion with a first radius of curvature. A dynamic seal element is configured to engage the valve body and includes a second curved portion having a second radius of curvature which is larger than the first radius of curvature. An actuator is operable to selectively bias the dynamic seal element into and out of engagement with the valve body so that when it is biased into engagement with the valve body the web of substrate material is engaged between the sealing surfaces of the dynamic seal element and the valve body. Also disclosed is a processing system which includes the pinch valve.

Abstract: A web support assembly for a moving web of substrate material includes a base having a primary support arm pivotally mounted thereto so as to be displaceable from a first position to a second position. The web support assembly includes a first biasing member in mechanical communication with the primary support arm. The first biasing member operates to impart a first biasing force to the primary support arm so as to move it from its first position to its second position. The system includes a dancer arm which is pivotally mounted to the primary support arm so as to be displaceable from a first position to a second position relative primary support arm. The web support assembly further includes a second biasing member in mechanical communication with the dancer arm. The second biasing member operates to impart a second biasing force to the dancer arm so as to move it from its first position to its second position. A roller is rotatably supported on the dancer arm.

Abstract: A pinch valve includes a valve body having a slot which is configured to allow a web of substrate material to pass therethrough. The valve body has a sealing surface which includes a first curved portion with a first radius of curvature. A dynamic seal element is configured to engage the valve body and includes a second curved portion having a second radius of curvature which is larger than the first radius of curvature. An actuator is operable to selectively bias the dynamic seal element into and out of engagement with the valve body so that when it is biased into engagement with the valve body the web of substrate material is engaged between the sealing surfaces of the dynamic seal element and the valve body. Also disclosed is a processing system which includes the pinch valve.

Abstract: A system for the continuous deposition of a semiconductor material onto one or more webs of substrate material which are advanced therethrough includes a web transport system having a plurality of web support assemblies. Each web support assembly includes a base having a primary support arm pivotally mounted thereto so as to be displaceable from a first position to a second position. The support includes a first biasing member in mechanical communication with the primary support arm. The first biasing member operates to impart a first biasing force to the primary support arm so as to move it from its first position to its second position. The support includes a dancer arm which is pivotally mounted to the primary support arm so as to be displaceable from a first position to a second position relative to the primary support arm. The system further includes a second biasing member in mechanical communication with the dancer arm.

Abstract: A apparatus for depositing one or more thin film layers on one or more continuous web or discrete substrates. The apparatus includes a pay-out unit for dispensing one or a plurality of webs, a deposition unit that deposits a series of one or more thin film layers thereon, and a take-up unit that receives and stores the webs following deposition. In a preferred embodiment, deposition occurs through plasma enhanced chemical vapor deposition in which a plasma region is formed between a cathode in the deposition unit and one or more vertically-oriented webs. The instant deposition apparatus includes a support system for guiding and stabilizing the transport of one or more webs or substrates through the deposition chambers. The support system includes a magnetic guidance assembly and an edge-stabilizing assembly that operate to inhibit perturbations of the motion of a web or substrate in directions other than the direction of transport through the apparatus.

Abstract: A high throughput apparatus for depositing one or more thin film layers on a plurality of continuous web substrates. The apparatus includes a pay-out unit for dispensing a plurality of webs, a deposition unit that receives the plurality of webs and deposits a series of one or more thin film layers thereon, and a take-up unit that receives and stores the plurality of webs upon deposition of the thin film layers. High throughput is achieved through the simultaneous deposition of thin films on a plurality of web substrates. In a preferred embodiment, deposition occurs through plasma enhanced chemical vapor deposition in which a plasma region is formed between a cathode in the deposition unit and the plurality of webs. Deposition precursors are introduced into the plasma region and are transformed to reactive species that form a thin film layer on the plurality of web substrates.

Abstract: Lightweight semiconductor devices are fabricated upon a relatively thin substrate member by a process wherein the substrate is first bonded to a relatively thick support member. The semiconductor device is then formed on the bonded substrate, and the substrate is subsequently removed from the support member by utilizing a beam of radiant energy to skive the substrate from the support member without damage to the semiconductor device. Also disclosed herein is a system for implementing the invention.

Abstract: A large area photovoltaic device includes a plurality of photovoltaic regions electrically interconnected in parallel. The regions are defined by a plurality of conductive channels which establish electrical contact between a top transparent electrode of the device and a monolithic, metal substrate electrode. A second terminal of the device is provided by a bottom, metallic electrode disposed beneath the semiconductor body, and upon an electrically insulating layer which is supported upon the metallic substrate.

Abstract: A large area photovoltaic device includes a plurality of photovoltaic regions electrically interconnected in parallel. The regions are defined by through hole connections which establish electrical contact between a top transparent electrode and a monolithic metal substrate. A second terminal is provided by a bottom, metallic electrode disposed upon an electrically insulating layer supported on the metallic substrate.

Abstract: A photovoltaic roofing shingle includes a strip of roofing material having an overlap portion, and a plurality of tab portions depending therefrom. Each of the tab portions includes a photovoltaic generating device affixed thereto. The photovoltaic devices are electrically interconnected, and each photovoltaic shingle member includes a pair of electrical terminals for delivering power from said photovoltaic devices. In use, the shingle members are affixed to a roof so that the tab portions of one row of shingles cover the overlap portion of an adjoining row. Electrical interconnection may be made through the roof to the inside of the building, or to a point atop the roof.