Abstract: In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.

Abstract: In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.