Patents by Inventor Mark M. Konarski
Mark M. Konarski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10995210Abstract: A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.Type: GrantFiled: November 25, 2019Date of Patent: May 4, 2021Assignee: Henkel IP & Holding GmbHInventors: Mark M. Konarski, Donna M. Mamangun, Ling Li
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Patent number: 10815388Abstract: Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.Type: GrantFiled: November 25, 2015Date of Patent: October 27, 2020Assignee: Henkel IP & Holding GmbHInventors: Mark M. Konarski, Nicholas Penrose, Darren Nolan, Brian Deegan
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Publication number: 20200095418Abstract: A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.Type: ApplicationFiled: November 25, 2019Publication date: March 26, 2020Inventors: Mark M. Konarski, Donna M. Mamangun, Ling Li
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Publication number: 20160075902Abstract: Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.Type: ApplicationFiled: November 25, 2015Publication date: March 17, 2016Inventors: Mark M. Konarski, Nicholas Penrose, Darren Nolan, Brian Deegan
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Patent number: 9080084Abstract: Photolytically induced redox curable compositions, which show a delayed onset of cure resulting in controllable “open times” for the end user consumer, are provided. These compositions are activated by exposure to electromagnetic radiation, such as UV/VIS radiation with a wavelength in the range of 254-470 nm, but show a commercially meaningful “open time” prior to cure. This property is particularly attractive when opaque substrates and/or substrates with low transmissivity are to be assembled.Type: GrantFiled: January 9, 2014Date of Patent: July 14, 2015Assignee: Henkel IP & Holding GmbHInventor: Mark M. Konarski
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Publication number: 20140124134Abstract: Photolytically induced redox curable compositions, which show a delayed onset of cure resulting in controllable “open times” for the end user consumer, are provided. These compositions are activated by exposure to electromagnetic radiation, such as UV/VIS radiation with a wavelength in the range of 254-470 nm, but show a commercially meaningful “open time” prior to cure. This property is particularly attractive when opaque substrates and/or substrates with low transmissivity are to be assembled.Type: ApplicationFiled: January 9, 2014Publication date: May 8, 2014Applicant: Henkel US IP LLCInventor: Mark M. Konarski
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Patent number: 7915319Abstract: The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.Type: GrantFiled: December 19, 2005Date of Patent: March 29, 2011Assignee: Henkel CorporationInventors: Mark M. Konarski, Edwin R. Perez, Eerik Maandi, Vic Kadziela, Steven J. Hemsen, Ronald E. Belek
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Patent number: 7547735Abstract: The present invention provides a UV curable composition comprising an acrylate component, comprising an acrylate-functionalized hydrogenated polybutadiene, and at least one mono-functional acrylate, and a photoinitiator combination triggered upon exposure to radiation at 365 nm of the electromagnetic spectrum comprising a bisacyl phosphine oxide and benzophenone, where when dispensed at a thickness of about 1 mm and exposed to UV radiation generated at a wavelength of 365 nm the composition cures through the thickness of the dispensed composition at a speed between 40 mm/sec to 100 mm/sec.Type: GrantFiled: December 4, 2006Date of Patent: June 16, 2009Assignee: Henkel CorporationInventors: Mark M. Konarski, Joel D. Schall
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Patent number: 7193016Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification.Type: GrantFiled: October 27, 2003Date of Patent: March 20, 2007Assignee: Henkel CorporationInventors: John G. Woods, Mark M. Konarski, Kyra M. Kozak, Yuhshi Luh
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Patent number: 7109061Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.Type: GrantFiled: November 6, 2001Date of Patent: September 19, 2006Assignee: Henkel CorporationInventors: Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff
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Patent number: 7108920Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.Type: GrantFiled: September 15, 2000Date of Patent: September 19, 2006Assignees: Henkel Corporation, Loctite (R&D) LimitedInventors: Lawrence N. Crane, Mark M. Konarski, Brendan J. Kneafsey, Afranio Torres-Filho, Z. Andrew Szczepaniak
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Patent number: 7087304Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.Type: GrantFiled: February 19, 2003Date of Patent: August 8, 2006Assignee: Henkel CorporationInventors: John G. Woods, Yuhshi Luh, Mark M. Konarski
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Patent number: 7009009Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.Type: GrantFiled: September 8, 2003Date of Patent: March 7, 2006Assignee: Henkel CorporationInventors: Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods
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Patent number: 6951907Abstract: A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine groups wherein the weight ratio of epoxy resin:adhesion promotor being from about 2:1 to about 20:1, (c) a curative of a nitrogen-containing compound and a transition metal complex; and, optionally, a polysulfide toughening agent.Type: GrantFiled: April 14, 2003Date of Patent: October 4, 2005Assignee: Henkel CorporationInventor: Mark M. Konarski
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Patent number: 6893736Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.Type: GrantFiled: November 15, 2002Date of Patent: May 17, 2005Assignee: Henkel CorporationInventor: Mark M. Konarski
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Patent number: 6818318Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.Type: GrantFiled: April 14, 2003Date of Patent: November 16, 2004Assignee: Henkel CorporationInventor: Mark M. Konarski
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Patent number: 6706417Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.Type: GrantFiled: November 25, 2002Date of Patent: March 16, 2004Assignee: Henkel Loctite CorporationInventors: Mark M. Konarski, Jeremy J. Bober
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Patent number: 6670430Abstract: Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.Type: GrantFiled: November 20, 2000Date of Patent: December 30, 2003Assignee: Henkel Loctite CorporationInventor: Mark M. Konarski
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Patent number: 6667194Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.Type: GrantFiled: February 26, 2002Date of Patent: December 23, 2003Assignee: Henkel Loctite CorporationInventors: Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods
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Patent number: 6632893Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.Type: GrantFiled: November 19, 2001Date of Patent: October 14, 2003Assignee: Henkel Loctite CorporationInventors: Mark M. Konarski, Zbigniew A. Szczepaniak