Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Abstract: Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.

Abstract: Embodiments of the present invention provide a spring loaded attachment mechanism for attaching a camera to a camera support or base. In one embodiment, a camera attachment apparatus comprises an attachment socket connected to a camera, the attachment socket including an aperture extending in a longitudinal direction and a pair of cutouts disposed laterally on opposite sides of the attachment socket; a spring having a pair of spring arms disposed respectively at the pair of cutouts on opposite sides of the attachment socket; and an attachment pin including a post having a longitudinal axis and configured to be inserted into the aperture of the attachment socket along the longitudinal direction, the post including a pair of seats disposed on opposite sides of the post to receive the pair of spring arms of the spring via the pair of cutouts of the attachment socket.