Abstract: A cooling system for a fuel tank of an aircraft includes a temperature sensor, a cooling system, and a control module. The temperature sensor detects a fuel temperature within the fuel tank. The cooling system maintains the fuel temperature below a control temperature. The phase change cooling system includes a heat exchanger. A cooling fluid flows through the heat exchanger and is in thermal communication with a surface of the fuel tank. The control module is in signal communication with the temperature sensor and the cooling system. The control module includes control logic for monitoring the temperature sensor, determining if the fuel temperature is above the control temperature, and generating an activation signal.

Abstract: A cooling system for a fuel tank of an aircraft includes a temperature sensor, a cooling system, and a control module. The temperature sensor detects a fuel temperature within the fuel tank. The cooling system maintains the fuel temperature below a control temperature. The phase change cooling system includes a heat exchanger. A cooling fluid flows through the heat exchanger and is in thermal communication with a surface of the fuel tank. The control module is in signal communication with the temperature sensor and the cooling system. The control module includes control logic for monitoring the temperature sensor, determining if the fuel temperature is above the control temperature, and generating an activation signal.

Abstract: A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip. The components from the 2D chip are layered and coupled to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.

Abstract: A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.

Abstract: A computer system unit which includes an acoustic dampening cooling fan shroud panel mounted on a rear surface thereof. The computer system unit is generally rectangular, encloses an electronic component package and includes a front panel and a pair of generally parallel side panels. An intermediate rear panel, generally parallel to the front panel, mounts one or more cooling fans which draw air through the generally rectangular unit. A cooling fan shroud panel which includes an acoustic noise reduction lining is then mounted to the intermediate rear panel. The cooling fan shroud panel includes an aperture for ventilation which is displaced from the mounting position of the cooling fans such that acoustic noise resultant from cooling fan operation is minimized. The aperture within the cooling fan shroud panel extends into at least one surface thereof which is not parallel to either the side panel or the intermediate rear panel wherein ventilation is substantially unobstructed by adjacent vertical surfaces.