Patents by Inventor Mark MacDonald

Mark MacDonald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11660779
    Abstract: The invention provides methods and compositions for treating wash water from concrete production with carbon dioxide. The treated wash water can be reused as mix water in fresh batches of concrete.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 30, 2023
    Assignee: CARBONCURE TECHNOLOGIES INC.
    Inventors: George Sean Monkman, Mark MacDonald, Dean Paul Forgeron
  • Publication number: 20230124192
    Abstract: Example heating and cooling systems for edge data centers are disclosed herein. A system disclosed herein includes a subterranean vault to be disposed at least partially below ground level an of environment, an edge data center in the subterranean vault, and a geothermal heat pump system to regulate a temperature of ambient air in the subterranean vault.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Inventors: Kevin Liedtke, Patrick Connor, James Hearn, Francesc Guim Bernat, Mark MacDonald
  • Patent number: 11545410
    Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 3, 2023
    Assignee: INTEL CORPORATION
    Inventors: Mark MacDonald, David Pidwerbecki, Mark Gallina, Jerrod Peterson
  • Publication number: 20220390995
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed that prevent heat pipe dryout. An example apparatus includes processor circuitry to at least one of instantiate or execute machine readable instructions to: determine if a temperature of a heat pipe of an electronic device is below a first threshold temperature; cause a program to switch from a first operating mode to a second operating mode when the temperature is below the first threshold temperature, the second operating mode to use more processor circuitry bandwidth than the first operating mode; determine at least one of (1) an occurrence of an increase in a power level of the electronic device or (2) the temperature of the heat pipe satisfies a second threshold temperature; and cause the program to switch from the second operating mode to the first operating mode based on at least one of (1) the occurrence of the increase in the power level or (2) the temperature of the heat pipe satisfying the second threshold temperature.
    Type: Application
    Filed: August 17, 2022
    Publication date: December 8, 2022
    Inventors: Shantanu Kulkarni, Christopher Moore, Jose Diaz Marin, Mark MacDonald
  • Publication number: 20220214730
    Abstract: Liquid cooling systems and coolers for electronic devices are disclosed herein. An example cooler includes a first thermal block having a first fluid passageway, a second thermal block having a second fluid passageway, and a thermoelectric cooler (TEC) coupled between the first thermal block and the second thermal block. The second thermal block is to be disposed on a processor of an electronic device such that the second thermal block is disposed between the TEC and the processor.
    Type: Application
    Filed: March 17, 2022
    Publication date: July 7, 2022
    Inventors: Arturo Navarro Alvarez, Jose Diaz Marin, Mark MacDonald, Akhilesh Rallabandi, Jose Salazar Delgado
  • Publication number: 20220179477
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 9, 2022
    Inventor: Mark MacDonald
  • Publication number: 20220127887
    Abstract: A tilt-up door for a building having a relatively wide door opening having a door panel including top and bottom horizontal members and vertical side members connected to the top and bottom horizontal members.
    Type: Application
    Filed: October 26, 2020
    Publication date: April 28, 2022
    Applicant: WELL BILT INDUSTRIES USA, LLC
    Inventors: MARK MACDONALD, RYAN BOSCO DSOUZA, MOREY WILKERSON
  • Publication number: 20220113757
    Abstract: Apparatus, systems, and methods for intelligent tuning of overclocking frequency are disclosed. An example apparatus includes trial control circuitry to execute an optimization model to select first values for overclocking parameters of a processor, the first values associated with a first trial, and perform benchmark testing of the processor when the processor is operating based on the first values; trial evaluation circuitry to calculate a first score for the first trial based on the benchmark testing; and model updating circuitry to perform a comparison of the first score to a second score, the second score associated with a second trial for second values for the overclocking parameters, the second values different than the first values; and select one of the first values or the second values to overclock the processor based on the comparison.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 14, 2022
    Inventors: Jin Yan, Hui Xiong, Jianfang Zhu, Felipe Gonzalez, Mark MacDonald, Daniel Ragland, Rodny Rodriguez, Matthew Fife, Yifan Li, Kristoffer Fleming
  • Publication number: 20220010808
    Abstract: Volumetric resistance blowers are disclosed herein. An example volumetric resistance blower includes a housing, a motor, and a rotor disposed within the housing and rotated by the motor. The rotor is constructed of metal foam.
    Type: Application
    Filed: September 13, 2021
    Publication date: January 13, 2022
    Inventors: David Kennedy, Ruander Cardenas, Mark MacDonald, James Raupp
  • Patent number: 11209893
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: December 28, 2021
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Publication number: 20210329811
    Abstract: Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 21, 2021
    Inventors: Mark MacDonald, Akhilesh Rallabandi, Ellann Cohen, Michael Nakanishi, John Carver, Arturo Navarro Alvarez, Oleg Krishcko
  • Patent number: 11132857
    Abstract: Various systems and methods for providing a smart entry system are described herein. A smart entry system includes a detector to detect a person near a portal to a room; a transceiver to attempt to establish a wireless connection between the smart entry system and a user device associated with the person; and a user interface to present a notification to the person based on a state of the wireless connection.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: September 28, 2021
    Assignee: Intel Corporation
    Inventors: David W. Browning, Mark MacDonald, Yoshifumi Nishi
  • Patent number: 11118598
    Abstract: Volumetric resistance blowers are disclosed herein. An example volumetric resistance blower includes a housing, a motor, and a rotor disposed within the housing and rotated by the motor. The rotor is constructed of metal foam.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: David Kennedy, Ruander Cardenas, Mark MacDonald, James Raupp
  • Patent number: 11095985
    Abstract: An example apparatus includes: a first earpiece to be positioned proximate a first ear of a user and including: a first microphone to transduce ambient sound external to the first earpiece into a first ambient audio signal, the ambient sound including sound indicative of a potential danger; and a first speaker to transduce a first input audio signal into music and the first ambient audio signal into the sound indicative of the potential danger; and a second earpiece to be positioned proximate a second ear of the user and including: a second microphone to transduce the ambient sound external to the second earpiece into a second ambient audio signal, the ambient sound including the sound indicative of the potential danger; and a second speaker to transduce a second input audio signal into the music and the second ambient audio signal into the sound indicative of the potential danger.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: August 17, 2021
    Assignee: Intel Corporation
    Inventors: Rajesh Poornachandran, David Gottardo, Swarnendu Kar, Saurabh Dadu, Mark MacDonald
  • Patent number: 11059375
    Abstract: Robots and apparatus, systems and methods for powering robots are disclosed. A disclosed conductive floor to power a robot on the floor includes a plurality of stationary conductors positioned in a pattern and a power delivery circuit to cause adjacent ones of the conductors to have different electrical potentials, the adjacent ones of the conductors to form a circuit to deliver power to the robot via contacts formed in a bottom surface of the robot.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: July 13, 2021
    Assignee: INTEL CORPORATION
    Inventors: David W. Browning, Yoshifumi Nishi, Mark MacDonald
  • Publication number: 20210171496
    Abstract: New solid forms of the plasma kallikrein inhibitor, 1-({4-[(5-fluoro-2-oxopyridin-1-yl)methyl]phenyl}methyl)-N-[(3-fluoro-4-methoxypyridin-2-yl)methyl]-3-(methoxymethyl)pyrazole-4-carboxamide and its salts, are described.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 10, 2021
    Inventors: David Malcolm CROWE, Stephen Mark MACDONALD-BROWN, Edwin ARET, Kiran GANDHI, Ruben Henricus Carolus Adrianus Titus LELIEVELD, Emma Kay SHARP, Richard Simon TODD
  • Publication number: 20210059073
    Abstract: Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Applicant: Intel Corporation
    Inventors: Gaurav Patankar, Ruander Cardenas, Mark MacDonald, Akhilesh P. Rallabandi
  • Publication number: 20210055780
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 25, 2021
    Inventor: Mark MacDonald
  • Patent number: 10927042
    Abstract: The invention provides compositions and methods directed to carbonation of a cement mix during mixing. The carbonation may be in a stationary mixer or a transportable mixer, such as a drum of a ready-mix truck.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: February 23, 2021
    Assignee: CARBONCURE TECHNOLOGIES, INC.
    Inventors: George Sean Monkman, Kevin Cail, Paul J. Sandberg, Mark MacDonald, Joshua Jeremy Brown, Dean Paul Forgeron
  • Patent number: 10914308
    Abstract: Some embodiments of an apparatus and system are described for a crossflow blower. An apparatus may comprise an enclosure having a first side and a second side where a portion of the first side is recessed in a direction of the second side. The enclosure may also comprise a first internal height between the first side and the second side and a second internal height between the recessed portion of the first side and the second side. The enclosure may also comprise a motor and a crossflow blower arranged to generate a flow of air between the first side and the second side in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 9, 2021
    Assignee: INTEL CORPORATION
    Inventors: Mark MacDonald, Jessica Gullbrand, Michael Izenson, Walter Swift, Eric Baugh