Patents by Inventor Mark MATSCO

Mark MATSCO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12133970
    Abstract: A drug injection device consists of a body, a cap, a striker, a spin wheel, a button, a spring, an ampoule, and optionally a needle. Each of the body, the cap, the striker, the spin wheel and the button is a molded plastic part, made out of mostly polycarbonate, which slide, snap, screw or rest in place, without the use of adhesives or fasteners. Also disclosed is a system for recycling a drug injection device having molded plastic parts made from mostly polycarbonates, comprising disassembling the drug injection device, separating the molded plastic parts from all other parts, and reprocessing the molded plastic parts together into recycled resin, which may be through regrinding, melting, and pelletizing.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: November 5, 2024
    Assignees: Covestro LLC, Covestro Deutschland AG
    Inventors: Isaac Platte, Mark Matsco, Pierre Moulinie, Lauren Zetts, Paul Nowatzki, Marc Uerdingen
  • Publication number: 20240277939
    Abstract: A drug injection device consists of a body, a cap, a striker, a spin wheel, a button, a spring, an ampoule, and optionally a needle. Each of the body, the cap, the striker, the spin wheel and the button is a molded plastic part, made out of mostly polycarbonate, which slide, snap, screw or rest in place, without the use of adhesives or fasteners. Also disclosed is a system for recycling a drug injection device having molded plastic parts made from mostly polycarbonates, comprising disassembling the drug injection device, separating the molded plastic parts from all other parts, and reprocessing the molded plastic parts together into recycled resin, which may be through regrinding, melting, and pelletizing.
    Type: Application
    Filed: July 25, 2022
    Publication date: August 22, 2024
    Inventors: Isaac Platte, Mark Matsco, Pierre Moulinie, Lauren Zetts, Paul Nowatzki, Marc Uerdingen
  • Patent number: 11112103
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 7, 2021
    Assignees: Covestro LLC, Thermal Solution Resources, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • Publication number: 20190093874
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 28, 2019
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • Patent number: 10156352
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 18, 2018
    Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • Publication number: 20160084490
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: April 16, 2014
    Publication date: March 24, 2016
    Inventors: Terry G. DAVIS, David ROCCO, Mikhail SAGAL, Jessee MCCANNA, Nicolas SUNDERLAND, James LORENZO, Mark MATSCO, Kevin DUNAY