Patents by Inventor Mark Mayeda

Mark Mayeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cooling chuck with direct coupled peltier unit
    Publication number: 20040248430
    Abstract: A device for transferring an object between manufacturing steps includes a transfer surface for receiving an object having an initial temperature from a first manufacturing step, for transporting the object from the first manufacturing step to another manufacturing step, and for transferring the object having a final temperature from the transfer surface to the other manufacturing step; and at least one Peltier unit coupled to the transfer surface for effecting a temperature change of the object from the initial temperature to the final temperature at a controlled rate.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 9, 2004
    Inventors: Rennie Barber, Mark Mayeda
  • Cooling element for a semiconductor fabrication chamber
    Patent number: 5942038
    Abstract: A novel semiconductor fabrication chamber includes a quartz vessel and a metal vessel with a resilient sealing member disposed between the quartz and metal vessels to define a vacuum chamber, along with a cooling assembly mounted on a quartz flange extending around the perimeter of the quartz vessel. A liquid or gaseous cooling medium is passed through the cooling assembly to reduce the operating temperature of a portion of the resilient sealing member in contact with the quartz flange during semiconductor fabrication processing so as to extend the useful life of the sealing member. The cooling assembly is secured to the quartz flange using a plurality of clamping fixtures for easy installation and retrofitting.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: August 24, 1999
    Assignee: LSI Logic Corporation
    Inventors: Mark Mayeda, Rennie Barber
  • Cooling element for a semiconductor fabrication chamber
    Patent number: 5497727
    Abstract: A novel semiconductor fabrication chamber includes a quartz vessel and a metal vessel with a resilient sealing member disposed between the quartz and metal vessels to define a vacuum chamber, along with a cooling assembly mounted on a quartz flange extending around the perimeter of the quartz vessel. A liquid or gaseous cooling medium is passed through the cooling assembly to reduce the operating temperature of a portion of the resilient sealing member in contact with the quartz flange during semiconductor fabrication processing so as to extend the useful life of the sealing member. The cooling assembly is secured to the quartz flange using a plurality of clamping fixtures for easy installation and retrofitting.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: March 12, 1996
    Assignee: LSI Logic Corporation
    Inventors: Mark Mayeda, Rennie Barber