Abstract: A method for providing an optical erase memory structure including: forming a metal-insulator-metal memory cell; positioning a light emitting diode adjacent to the metal-insulator-metal memory cell; and emitting a light emission from the light emitting diode for erasing the metal-insulator-metal memory cell.

Abstract: A method for providing an optical erase memory structure including: forming a metal-insulator-metal memory cell; positioning a light emitting diode adjacent to the metal-insulator-metal memory cell; and emitting a light emission from the light emitting diode for erasing the metal-insulator-metal memory cell.

Abstract: A memory erase management system is provided, including providing a resistive change memory cell, coupling a first line to the resistive change memory cell, coupling a line buffer to the first line, providing a charge storage device coupled to the line buffer, and performing a single pulse erase of the resistive change memory cell by discharging a current from the charge storage device through the resistive change memory cell.

Abstract: A memory erase management system is provided, including providing a resistive change memory cell, coupling a first line to the resistive change memory cell, coupling a line buffer to the first line, providing a charge storage device coupled to the line buffer, and performing a single pulse erase of the resistive change memory cell by discharging a current from the charge storage device through the resistive change memory cell.

Abstract: A system and method are disclosed for improved memory performance in a mobile device. A mobile device incorporating teachings disclosed herein may include, for example, a central processing unit (CPU) residing on a first chip. The mobile device may also include a memory system residing on a second chip. The memory system may include, for example, a memory controller and at least one type of memory combined in a single multi-chip package. The multi-chip package may effectively internalize higher pin count interfaces interconnecting the memory controller and the at least one type of memory. With some implementations, a high frequency, low pin-count external bus may form at least a portion of a link communicatively coupling the multi-chip package and the CPU. In practice, the high frequency, low pin-count external bus may physically connect to a bus interface residing on the first chip. The bus interface may be communicatively coupled to the CPU via an internal CPU bus also located on the first chip.

Abstract: The uniqueness of this invention is how many different things you can use it to carry. The name “The Outdoor Carry-All” is derived from the fact that the product is an outdoor product and is versatile in what it can carry. It also takes less time to take items on and off then anything on the market today. Simply pull one pin and you're done. There are no wrenches or time-consuming effort to put items on or take them off. This does not mount to the rack of an ATV, so it doesn't dent or scratch the rack or ATV.