Abstract: A molded plastic table has a removable advertising piece made of plastic, cardboard, label material, magnetic material, or the like, that can be used for couponing, collecting, or as a refrigerator magnet for future advertising. The table can act as a device to support a carton top while providing for an advertising vehicle.

Abstract: A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface, securing an integrated electronic component to the first substrate surface, and disposing a first dielectric layer on the first substrate surface and over the first integrated electronic component. The method additionally includes disposing a metallic layer on the first dielectric layer to produce an integrated electronic component assembly, producing in the integrated electronic component assembly at least one via having a metal lining in contact with the metallic layer, and disposing a second dielectric layer over the via and over the metallic layer.

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: An interposer and method for producing an interposer. The method comprises forming in a substrate a cladding layer having a known density value; and forming in the substrate a waveguide core layer in contact with the cladding layer and also having a known density value which is greater than the density value of the cladding layer. The method further includes forming in the substrate a second cladding layer in contact with the waveguide core layer and having a known density value less than the density value of the waveguide core layer. A method for producing a light-guiding structure comprising forming in a substrate a cladding layer having a top substrate surface and a porosity value; and forming in the substrate a waveguide core layer in contact with the cladding layer and having a porosity value less than the porosity value of the cladding layer.

Abstract: An interposer and method for producing an interposer. The method comprises forming in a substrate a cladding layer having a known density value; and forming in the substrate a waveguide core layer in contact with the cladding layer and also having a known density value which is greater than the density value of the cladding layer. The method further includes forming in the substrate a second cladding layer in contact with the waveguide core layer and having a known density value less than the density value of the waveguide core layer. A method for producing a light-guiding structure comprising forming in a substrate a cladding layer having a top substrate surface and a porosity value; and forming in the substrate a waveguide core layer in contact with the cladding layer and having a porosity value less than the porosity value of the cladding layer.

Abstract: A method for depositing solder bumps on a circuit substrate. The method comprises forming a dielectric layer on the circuit substrate which includes a plurality of conductive regions. The dielectric layer is patterned and opened to expose the conductive regions. A solder bump is disposed on each of the conductive regions, and a barrier layer is disposed on each of the solder bumps. Subsequently, the method includes forming a second solder bump on each of the first solder bumps. In an alternative method, solder bumps are initially disposed on each of the conductive regions and are then covered with a dielectric material. Subsequently, the dielectric material and a portion of the solder bumps are removed, and a barrier layer is disposed on each of the remaining structures of the solder bumps. The second solder bump material may then be disposed on the barrier layer. The articles produced by the methods of the present invention include semiconductor substrates or wafers having stacked solder bumps.

Abstract: A method for forming a plurality of solder bumps comprising providing a pair of metallic supports. An initial solder layer is respectively disposed on each of the metallic supports which may be a metal-filled blind via. One or two additional solder layers are disposed on one of the initial solder layers. A multilayered packaging assembly includes the solder layer(s) on a plurality of substrates which are coupled together.

Abstract: Methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes at least partially through a multilayer circuit structure. The formed multilayer circuit structures can occupy less space than corresponding multilayer circuit structures with stacked via structures.

Abstract: A starting and operating apparatus and method for a sensorless, brushless direct current motor is disclosed. During start-up, the excitation to the motor is turned off while the slope of the differential back electromotive force of the floating phases is sampled. This indicates when the proper rotation and torque of the motor is obtained. After starting the motor, the apparatus samples the slope of the back electromotive force of the floating coils and finds a zero or predetermined slope condition which has been found to be near the optimum switching point for commutation from one phase to the next. A masking circuit is included to prevent an unwanted commutation immediately after commutating to the next phase.