Patents by Inventor Mark McMeen

Mark McMeen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12163996
    Abstract: A system for testing an electronic circuit board test coupon, including a test chamber. The test chamber can have at least one port through which a port extension member holding a test coupon can be inserted, minimizing air flow between the interior space of the test chamber and the surrounding area to adequately maintain elevated heat and humidity conditions within the test chamber.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: December 10, 2024
    Assignee: Magnalytix, LLC
    Inventors: Michael L. Bixenman, Thomas M. Forsythe, Mark McMeen, Colin Langley, James Perigen, Bobby Glidwell
  • Publication number: 20230236240
    Abstract: A system for testing an electronic circuit board test coupon, including a test chamber. The test chamber can have at least one port through which a port extension member holding a test coupon can be inserted, minimizing air flow between the interior space of the test chamber and the surrounding area to adequately maintain elevated heat and humidity conditions within the test chamber.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 27, 2023
    Inventors: Michael L. Bixenman, Thomas M. Forsythe, Mark McMeen, Colin Langley, James Perigen, Bobby Glidwell
  • Publication number: 20210057131
    Abstract: A telecommunications cable for making high resistance measurements comprising a plurality of bundles, each comprising a twisted pair of Category 6a copper conductors and a metal foil shield, one of said copper conductors in each twisted pair serving as a signal wire and the other of said copper conductors in each twisted pair being grounded to thereby serve as a noise ground, a braided grounded metal sheath surrounding said plurality of bundles of twisted pairs; and a grounded shield used as an outer sleeve, whereby said cable is triple grounded.
    Type: Application
    Filed: October 13, 2020
    Publication date: February 25, 2021
    Applicant: Kyzen Corporation
    Inventor: Mark McMeen
  • Publication number: 20200234854
    Abstract: A telecommunications cable for making high resistance measurements comprising a plurality of bundles, each comprising a twisted pair of Category 6a copper conductors and a metal foil shield, one of said copper conductors in each twisted pair serving as a signal wire and the other of said copper conductors in each twisted pair being grounded to thereby serve as a noise ground; a braided grounded metal sheath surrounding said plurality of bundles of twisted pairs; and a grounded shield used as an outer sleeve, whereby said cable is triple grounded.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 23, 2020
    Applicant: Kyzen Corporation
    Inventor: Mark McMeen