Patents by Inventor Mark Morley

Mark Morley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical planarization topography control via implant
    Patent number: 9401285
    Abstract: Systems and methods for chemical mechanical planarization topography control via implants are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes increasing the content of at least one of silicon or germanium in at least select regions of a dielectric material thereby reducing the material removal rate for a chemical mechanical polishing (CMP) process at the select regions, and removing material from the dielectric material using the CMP process. In another embodiment, a method of manufacturing a semiconductor device includes increasing content of at least one of boron, phosphorus, or hydrogen in at least select regions of a dielectric material thereby increasing the material removal rate of a CMP process at the select regions, and removing material from the dielectric material using the CMP process.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: July 26, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Andrew Carswell, Tony M. Lindenberg, Mark Morley, Kyle Ritter, Lequn Liu
  • CHEMICAL MECHANICAL PLANARIZATION TOPOGRAPHY CONTROL VIA IMPLANT
    Publication number: 20160172208
    Abstract: Systems and methods for chemical mechanical planarization topography control via implants are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes increasing the content of at least one of silicon or germanium in at least select regions of a dielectric material thereby reducing the material removal rate for a chemical mechanical polishing (CMP) process at the select regions, and removing material from the dielectric material using the CMP process. In another embodiment, a method of manufacturing a semiconductor device includes increasing content of at least one of boron, phosphorus, or hydrogen in at least select regions of a dielectric material thereby increasing the material removal rate of a CMP process at the select regions, and removing material from the dielectric material using the CMP process.
    Type: Application
    Filed: December 16, 2014
    Publication date: June 16, 2016
    Inventors: Andrew Carswell, Tony M. Lindenberg, Mark Morley, Kyle Ritter, Lequn Liu
  • Water Distribution Systems
    Publication number: 20110191267
    Abstract: A method for use in the design of a water distribution by determining whether to locate a pressure reducing valve (PRV) in a given location.
    Type: Application
    Filed: May 19, 2009
    Publication date: August 4, 2011
    Inventors: Dragan Savic, Zoran Kapelan, Mark Morley, Lydia Vamvakeridou-Lyroudia, Josef Bicik, Hayham Awad