Patents by Inventor Mark Morrow

Mark Morrow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10892215
    Abstract: An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled to at least one device on a first side. A method including providing a supply from a package substrate to at least one transistor in a device stratum of a circuit structure; and distributing the supply to the at least one transistor using a supply line on an underside of the device stratum and contacting the at least one transistor on a device side by routing a contact from the supply line through the device stratum. A system including a package substrate, and a die including at least one supply line disposed on an underside of a device stratum and routed through the device stratum and coupled to at least one of a plurality of transistor devices on the device side.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: January 12, 2021
    Assignee: Intel Corporation
    Inventors: Donald W. Nelson, Mark T. Bohr, Patrick Morrow
  • Patent number: 10886217
    Abstract: Transistor cell architectures including both front-side and back-side structures. A transistor may include one or more semiconductor fins with a gate stack disposed along a sidewall of a channel portion of the fin. One or more source/drain regions of the fin are etched to form recesses with a depth below the channel region. The recesses may extend through the entire fin height. Source/drain semiconductor is then deposited within the recess, coupling the channel region to a deep source/drain. A back-side of the transistor is processed to reveal the deep source/drain semiconductor material. One or more back-side interconnect metallization levels may couple to the deep source/drain of the transistor.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: January 5, 2021
    Assignee: Intel Corporation
    Inventors: Patrick Morrow, Mauro J. Kobrinsky, Mark T. Bohr, Tahir Ghani, Rishabh Mehandru
  • Patent number: 10855809
    Abstract: A printer has first and second interfaces for connecting to first and second networks having first and second data host configuration protocol servers. The first and second interfaces have differing media access control (MAC) addresses. The printer uses a recovery sequence to enable recovery for a host computer running an application when switching from the first printer interface to the second printer interface.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: December 1, 2020
    Assignee: Avery Dennison Retail Information Services, LLC
    Inventors: Jeanne F. Duckett, Mark Morrow, Nikkolus Wortham
  • Publication number: 20200307838
    Abstract: An apparatus and method for filling a container with fragile fruit involving submerging the container in water to better distribute the fragile fruit within the container. The container may be filled with fragile fruit either before or after being submerged in water. The fragile fruit may be transported using a stream of water or other suitable fluid medium.
    Type: Application
    Filed: February 27, 2020
    Publication date: October 1, 2020
    Applicant: Sonoco Development, Inc.
    Inventors: Mark Morrow, Paul Miller, Timothy Vernarsky
  • Publication number: 20190312023
    Abstract: Integrated circuit (IC) cell architectures including a crenellated interconnect trace layout. A crenellated trace layout may be employed where an IC cell includes transistor having a source/drain terminal interconnected through a back-side (3D) routing scheme that reduces front-side routing density for a given transistor footprint. In the crenellated layout, adjacent interconnect traces or tracks may have their ends staggered according to a crenellation phase for the cell. Crenellated tracks may intersect one cell boundary with adjacent tracks intersecting an opposite cell boundary. Track ends may be offset by at least the width of an underlying orthogonal interconnect trace. Crenellated track ends may be offset by the width of an underlying orthogonal interconnect trace and half a spacing between adjacent orthogonal interconnect traces.
    Type: Application
    Filed: December 7, 2016
    Publication date: October 10, 2019
    Applicant: Intel Corporation
    Inventors: Patrick Morrow, Mauro J. Kobrinsky, Mark T. Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar
  • Publication number: 20190267316
    Abstract: An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled to at least one device on a first side. A method including providing a supply from a package substrate to at least one transistor in a device stratum of a circuit structure; and distributing the supply to the at least one transistor using a supply line on an underside of the device stratum and contacting the at least one transistor on a device side by routing a contact from the supply line through the device stratum. A system including a package substrate, and a die including at least one supply line disposed on an underside of a device stratum and routed through the device stratum and coupled to at least one of a plurality of transistor devices on the device side.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Inventors: Donald W. NELSON, Mark T. BOHR, Patrick MORROW
  • Publication number: 20190259699
    Abstract: Transistor cell architectures including both front-side and back-side structures. A transistor may include one or more semiconductor fins with a gate stack disposed along a sidewall of a channel portion of the fin. One or more source/drain regions of the fin are etched to form recesses with a depth below the channel region. The recesses may extend through the entire fin height. Source/drain semiconductor is then deposited within the recess, coupling the channel region to a deep source/drain. A back-side of the transistor is processed to reveal the deep source/drain semiconductor material. One or more back-side interconnect metallization levels may couple to the deep source/drain of the transistor.
    Type: Application
    Filed: December 23, 2016
    Publication date: August 22, 2019
    Applicant: Intel Corporation
    Inventors: Patrick Morrow, Mauro J. Kobrinsky, Mark T. Bohr, Tahir Ghani, Rishabh Mehandru
  • Patent number: 10325840
    Abstract: An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled to at least one device on a first side. A method including providing a supply from a package substrate to at least one transistor in a device stratum of a circuit structure; and distributing the supply to the at least one transistor using a supply line on an underside of the device stratum and contacting the at least one transistor on a device side by routing a contact from the supply line through the device stratum. A system including a package substrate, and a die including at least one supply line disposed on an underside of a device stratum and routed through the device stratum and coupled to at least one of a plurality of transistor devices on the device side.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: June 18, 2019
    Assignee: Intel Corporation
    Inventors: Donald W. Nelson, Mark T. Bohr, Patrick Morrow
  • Patent number: 10300450
    Abstract: The present disclosure provides apparatuses, systems, and methods involving a spotter for depositing a substance on a submerged surface. The spotter comprises an outlet cavity defined at least in part by a spotting orifice, a first opening, and a second opening. The spotter also comprises a first conduit fluidly coupled to the first opening and a second conduit fluidly coupled to the second opening. The spotter is adapted so that fluid flowing through the first conduit and the second conduit is communicated among the first opening, the second opening, and a submerged deposition surface when the sealing orifice is sealed against the submerged deposition surface to form a deposition spot on the submerged deposition surface. The submerged deposition surface is within a liquid such that the liquid covers the deposition spot upon removal of the orifice from the deposition surface.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: May 28, 2019
    Assignee: Carterra, Inc.
    Inventors: Bruce K. Gale, Joshua W. Eckman, Adam Miles, Christopher Morrow, James Smith, Sriram Natarajan, Mark Eddings
  • Publication number: 20170251079
    Abstract: A printer has first and second interfaces for connecting to first and second networks having first and second data host configuration protocol servers. The first and second interfaces have differing media access control (MAC) addresses. The printer uses a recovery sequence to enable recovery for a host computer running an application when switching from the first printer interface to the second printer interface.
    Type: Application
    Filed: February 27, 2017
    Publication date: August 31, 2017
    Inventors: Jeanne F. DUCKETT, Mark MORROW, Nikkolus WORTHAM
  • Patent number: 8080320
    Abstract: A metallized laminated structure suitable for making a rigid container having a metallic appearance is provided. The laminated structure includes a metallized film and a thermoplastic sheet. At least a portion of the thermoplastic sheet is bonded to the metallized film through a lamination process. The metallized film includes a metallic layer, a sealable layer, and a polypropylene core between the metallic layer and the sealable layer. The thermoplastic sheet includes at least one layer of a polypropylene or a thermoplastic olefin. Or the thermoplastic sheet includes at least one layer of a polypropylene and at least one layer of a thermoplastic olefin.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: December 20, 2011
    Assignee: Sonoco Development, Inc.
    Inventors: Subir K. Dey, Marion H. Weatherford, J. Mark Morrow
  • Publication number: 20100260993
    Abstract: A metallized laminated structure suitable for making a rigid container having a metallic appearance is provided. The laminated structure includes a metallized film and a thermoplastic sheet. At least a portion of the thermoplastic sheet is bonded to the metallized film through a lamination process. The metallized film includes a metallic layer, a sealable layer, and a polypropylene core between the metallic layer and the sealable layer. The thermoplastic sheet includes at least one layer of a polypropylene or a thermoplastic olefin. Or the thermoplastic sheet includes at least one layer of a polypropylene and at least one layer of a thermoplastic olefin.
    Type: Application
    Filed: June 25, 2010
    Publication date: October 14, 2010
    Inventors: Subir K. Dey, Marion H. Weatherford, J. Mark Morrow
  • Patent number: 7763361
    Abstract: A metallized laminated structure suitable for making a rigid container having a metallic appearance is provided. The laminated structure includes a metallized film and a thermoplastic sheet. At least a portion of the thermoplastic sheet is bonded to the metallized film through a lamination process. The metallized film includes a metallic layer, a sealable layer, and a polypropylene core between the metallic layer and the sealable layer. The thermoplastic sheet includes at least one layer of a polypropylene or a thermoplastic olefin. Or the thermoplastic sheet includes at least one layer of a polypropylene and at least one layer of a thermoplastic olefin.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: July 27, 2010
    Assignee: Sonoco Development, Inc.
    Inventors: Subir K. Dey, Marion H. Weatherford, J. Mark Morrow
  • Patent number: 7528727
    Abstract: A package and method for products is provided. The package includes a non-planar package comprising a wall formed of polymeric material, and at least one tracking device partially embedded within a thickness of the wall during forming of the package such that the tracking device is exposed and visible on a surface of the package.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: May 5, 2009
    Assignee: Sonoco Development, Inc.
    Inventor: J. Mark Morrow
  • Publication number: 20080131637
    Abstract: A metallized laminated structure suitable for making a rigid container having a metallic appearance is provided. The laminated structure includes a metallized film and a thermoplastic sheet. At least a portion of the thermoplastic sheet is bonded to the metallized film through a lamination process. The metallized film includes a metallic layer, a sealable layer, and a polypropylene core between the metallic layer and the sealable layer. The thermoplastic sheet includes at least one layer of a polypropylene or a thermoplastic olefin. Or the thermoplastic sheet includes at least one layer of a polypropylene and at least one layer of a thermoplastic olefin.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 5, 2008
    Inventors: Subir K. Dey, Marion H. Weatherford, J. Mark Morrow
  • Patent number: 6739500
    Abstract: A tubular container for fragile products is provided according to the present invention that includes a flexible end closure that moves inwardly against the products when vacuum is applied during packaging for providing cushioning support to the products. The flexible end closure is secured to an end of a tubular body wall having opposed ends and inner and outer surfaces and comprises a wound strip of material. A flexible liner having opposed end portions is secured to respective ends of the tubular body by way of an adhesive band between the liner and the inner surface of the tubular body wall. The flexible liner thus has a free medial portion between the end portions which moves inwardly against the products when vacuum is applied. A vent hole may be formed through the body ply and an outer label by way of a laser for allowing the passage of air therethrough.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: May 25, 2004
    Assignee: Sonoco Development, Inc.
    Inventors: Mike Gentile, Veronique Sins, J. Mark Morrow, James W. Lowry, Kenan Clougherty
  • Patent number: 6725630
    Abstract: A method for induction sealing a plastic part to a composite container using a pair of linear coils electrically connected to low frequency generators. The linear coils produce overlapping electromagnetic fields on either side of the container. Rotating the container assures even heating of the polyethylene liner and plastic part. The method produces a reliable seal between the liner and plastic part and can be used at high production speeds.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: April 27, 2004
    Assignee: Sonoco Development, Inc.
    Inventors: Keith R. Rea, Charles M. Braddock, Floyd Boatwright, J. Mark Morrow, James A. Lowry
  • Publication number: 20030089079
    Abstract: A method for induction sealing a plastic part to a composite container using a pair of linear coils electrically connected to low frequency generators. The linear coils produce overlapping electromagnetic fields on either side of the container. Rotating the container assures even heating of the polyethylene liner and plastic part. The method produces a reliable seal between the liner and plastic part and can be used at high production speeds.
    Type: Application
    Filed: November 15, 2001
    Publication date: May 15, 2003
    Inventors: Keith R. Rea, Charles M. Braddock, Floyd Boatwright, J. Mark Morrow, James A. Lowry
  • Patent number: 6341720
    Abstract: A one-piece dispensing top has three separate dispensing ports. Each dispensing port is designed to dispense particulate foodstuffs from a container. One port is configured to allow removal of product with an utensil. A second port is configured to be used for pouring product and includes a spout, and a third port is configured for sifting product. Each dispensing port includes a closure flap for sealing. All three closure flaps are integrally joined to the dispensing top via living hinges. The closure flaps may be retained in the closed position by a friction or snap fit.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: January 29, 2002
    Assignee: Sonoco Products Company
    Inventors: Michael Robert Schmit, James F. Kick, J. Mark Morrow
  • Patent number: D450584
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: November 20, 2001
    Assignee: Sonoco Products Company
    Inventors: Michael R. Schmit, James F. Kick, J. Mark Morrow