Patents by Inventor Mark Nepomnishy
Mark Nepomnishy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230133379Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: January 4, 2023Publication date: May 4, 2023Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Patent number: 11571895Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: October 21, 2020Date of Patent: February 7, 2023Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Publication number: 20210031521Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: October 21, 2020Publication date: February 4, 2021Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Patent number: 10850518Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: November 8, 2019Date of Patent: December 1, 2020Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Publication number: 20200070518Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: November 8, 2019Publication date: March 5, 2020Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Patent number: 10471718Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: July 3, 2018Date of Patent: November 12, 2019Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Publication number: 20180326729Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: July 3, 2018Publication date: November 15, 2018Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Publication number: 20180236771Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: February 23, 2017Publication date: August 23, 2018Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Patent number: 10052875Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: February 23, 2017Date of Patent: August 21, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
-
Patent number: 9362484Abstract: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.Type: GrantFiled: February 23, 2015Date of Patent: June 7, 2016Assignee: FUJIFILM CorporationInventors: Paul A. Hoisington, Jeffrey Birkmeyer, Andreas Bibl, Mats G. Ottosson, Gregory De Brabander, Zhenfang Chen, Mark Nepomnishy, Shinya Sugimoto
-
Patent number: 9159899Abstract: Processes for making a membrane having a curved feature are disclosed. Recesses each in the shape of a reversed, truncated pyramid are formed in a planar substrate surface by KOH etching through a mask. An oxide layer is formed over the substrate surface. The oxide layer can be stripped leaving rounded corners between different facets of the recesses in the substrate surface, and the substrate surface can be used as a profile-transferring substrate surface for making a membrane having concave curved features. Alternatively, a handle layer is attached to the oxide layer and the substrate is removed until the backside of the oxide layer becomes exposed. The exposed backside of the oxide layer includes curved portions protruding away from the handle layer, and can provide a profile-transferring substrate surface for making a membrane having convex curved features.Type: GrantFiled: May 13, 2013Date of Patent: October 13, 2015Assignee: FUJIFILM CorporationInventors: Gregory De Brabander, Mark Nepomnishy
-
Publication number: 20150171313Abstract: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.Type: ApplicationFiled: February 23, 2015Publication date: June 18, 2015Inventors: Paul A. Hoisington, Jeffrey Birkmeyer, Andreas Bibl, Mats G. Ottosson, Gregory De Brabander, Zhenfang Chen, Mark Nepomnishy, Shinya Sugimoto
-
Patent number: 8969105Abstract: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.Type: GrantFiled: July 22, 2011Date of Patent: March 3, 2015Assignee: FUJIFILM CorporationInventors: Paul A. Hoisington, Jeffrey Birkmeyer, Andreas Bibl, Mats G. Ottosson, Gregory De Brabander, Zhenfang Chen, Mark Nepomnishy, Shinya Sugimoto
-
Patent number: 8641171Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.Type: GrantFiled: May 30, 2012Date of Patent: February 4, 2014Assignee: FUJIFILM CorporationInventors: Gregory DeBrabander, Mark Nepomnishy
-
Publication number: 20140022304Abstract: Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion.Type: ApplicationFiled: September 23, 2013Publication date: January 23, 2014Inventors: Gregory De Brabander, Mark Nepomnishy, John A. Higginson
-
Patent number: 8628677Abstract: Processes for making a profile-transferring substrate surface and membranes having curved features are disclosed. A profile-transferring substrate surface having a curved feature is created by isotropic plasma etching through a shadow mask. The shadow mask has a through hole which has a lower portion adjacent to the bottom surface of the shadow mask and an upper portion that is above and narrower than the lower portion. The isotropic plasma etching through the shadow mask can create a curved dent in a planar substrate in a central portion of an area enclosed by the bottom opening. After the shadow mask is removed. A uniform layer of material deposited over the exposed surface of the substrate will include a curved feature at the location of the curved dent in the substrate surface.Type: GrantFiled: March 31, 2011Date of Patent: January 14, 2014Assignee: FUJIFILM CorporationInventors: Gregory De Brabander, Mark Nepomnishy
-
Publication number: 20130344630Abstract: A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle.Type: ApplicationFiled: August 23, 2013Publication date: December 26, 2013Applicant: FUJIFILM CorporationInventors: Mark Nepomnishy, Gregory De Brabander, Andreas Bibl
-
Publication number: 20130286097Abstract: Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Inventors: Gregory De Brabander, Mark Nepomnishy, John A. Higginson
-
Patent number: 8567910Abstract: A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle.Type: GrantFiled: March 31, 2010Date of Patent: October 29, 2013Assignee: FUJIFILM CorporationInventors: Mark Nepomnishy, Gregory De Brabander, Andreas Bibl
-
Publication number: 20130264911Abstract: Processes for making a membrane having a curved feature are disclosed. Recesses each in the shape of a reversed, truncated pyramid are formed in a planar substrate surface by KOH etching through a mask. An oxide layer is formed over the substrate surface. The oxide layer can be stripped leaving rounded corners between different facets of the recesses in the substrate surface, and the substrate surface can be used as a profile-transferring substrate surface for making a membrane having concave curved features. Alternatively, a handle layer is attached to the oxide layer and the substrate is removed until the backside of the oxide layer becomes exposed. The exposed backside of the oxide layer includes curved portions protruding away from the handle layer, and can provide a profile-transferring substrate surface for making a membrane having convex curved features.Type: ApplicationFiled: May 13, 2013Publication date: October 10, 2013Inventors: Gregory De Brabander, Mark Nepomnishy