Patents by Inventor Mark Nesbitt

Mark Nesbitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR MANAGEMENT OF CRYPTOCURRENCY SYSTEMS
    Publication number: 20210209586
    Abstract: Systems and methods for managing cryptocurrency systems.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Inventors: Shamiq Islam, Mark Nesbitt, Don Yu, Saroja Erabelli
  • System and method for management of cryptocurrency systems
    Patent number: 10984412
    Abstract: Systems and methods for managing cryptocurrency systems.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 20, 2021
    Assignee: Coinbase, Inc.
    Inventors: Shamiq Islam, Mark Nesbitt, Don Yu, Saroja Erabelli
  • SYSTEM AND METHOD FOR MANAGEMENT OF CRYPTOCURRENCY SYSTEMS
    Publication number: 20200097953
    Abstract: Systems and methods for managing cryptocurrency systems.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 26, 2020
    Inventors: Shamiq Islam, Mark Nesbitt, Don Yu, Saroja Erabelli
  • Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
    Patent number: 8115286
    Abstract: An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: February 14, 2012
    Assignee: Honeywell International Inc.
    Inventors: Wenwei Zhang, Len Muslek, Jamie Boyd, Mark Nesbitt, Martyn Dalziel
  • INTEGRATED SENSOR INCLUDING SENSING AND PROCESSING DIE MOUNTED ON OPPOSITE SIDES OF PACKAGE SUBSTRATE
    Publication number: 20100133629
    Abstract: An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.
    Type: Application
    Filed: October 16, 2009
    Publication date: June 3, 2010
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: WENWEI ZHANG, LEN MUSLEK, JAMIE BOYD, MARK NESBITT, MARTYN DALZIEL