Abstract: A computer-implemented method for identifying a best tool from a plurality of tools that perform a same operation in a semiconductor fabrication line that includes the steps of determining a first median yield for each of the plurality of tools within a first time interval, weighting the first median yield based on a total number of wafers processed by each of the plurality of tools within the first time interval, determining a second median yield for the semiconductor fabrication line over the first time interval, obtaining a weighted yield difference for each of the plurality of tools relative to the second median yield, and outputting the weighted yield difference for each of the plurality of tools.

Abstract: A system and method for finding operation/tool's combination which causes the integration failure in a semiconductor fabrication facility is disclosed. It comprises the steps of generating a candidate operation/tool list by selecting the operation/tool's that are more likely to cause said failure. Assign a weight value to each lot in the lot list for each operatioon/tool in said candidate operation/tool list, the weight value being a predetermined positive value for a bad lot, and a negative value for a good lot. Then select any pair of operation/tool's from said candidate operation/tool list and calculate a peak combination cumulative value for that pair of operation/tool's. Rank each pair of operation/tool's according to their corresponding peak combination cumulative values. It is determined the pair of operation/tool's with the greatest peak combination cumulative value the most likely to cause said failure.

Abstract: A high temperature RFID tag is described which has a survival temperature in the range of approximately −40° C. to 300° C. and an operating temperature in the range of approximately −20° C. to 200° C. In one embodiment of the invention, the RFID tag comprises a housing comprising a substantially flexible first thermally resistant material and having a base and a top, and a circuit board substrate comprising a substantially flexible second thermally resistant material which is encapsulated within the housing. In an additional embodiment of the invention, the high temperature RFID tag comprises a substrate assembly, the substrate assembly including a substrate having an integrated circuit disposed thereon, the substrate comprising a substantially flexible first thermally resistant material, and a high temperature encapsulant disposed on a first side of the substrate, the substrate assembly having a survival temperature in the range of −40° C. to 300° C.

Abstract: A high temperature RFID tag is described which has a survival temperature in the range of approximately -40.degree. C. to 300.degree. C. and an operating temperature of approximately -20.degree. C. to 200.degree. C. The RFID tag comprises a housing comprising a first thermally resistant material and having a base and a top, and a circuit board substrate comprising a second thermally resistant material which is encapsulated within the housing.