Abstract: A probe comprises a small “consumable” probe substrate permanently mounted to a circuit-under-test. The probe substrate includes a high-fidelity signal pathway, which is inserted into a conductor of the circuit-under-test, and a high-bandwidth sensing circuit which senses the signal-under-test as it propagates along the signal pathway. The probe substrate further includes a probe socket for receiving a detachable interconnect to a measurement instrument. Power is alternatively supplied to the probe by the circuit-under-test or the interconnect. When the interconnect is attached, control signals from the measurement instrument are supplied to the sensing circuit and the output of the sensing circuit is supplied to the measurement instrument. In one embodiment, the sensing circuit uses high-breakdown transistors in order to avoid the use of passive attenuation. In a further embodiment, the sensing circuit includes broadband directional sensing circuitry.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A signal acquisition probe has a double cushioned spring loaded probing tip assembly disposed in a housing. A first compressive element produces a first pre-loaded compressive force and an increasing compressive force on the probing tip assembly and a second compressive element produces a second pre-loaded compressive force and an increasing compressive force on the probing tip assembly subsequent to the first increasing compressive force. First and second double cushioned spring loaded probing tip assemblies may be disposed in a housing to produce a differential signal acquisition probe.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: An inverted strain relief for receiving a coaxial cable has a housing with a bore therethrough defining first and second apertures in opposing surfaces of the housing. The bore surface is defined by at least a first radius scribing an arc from the perimeter of the first aperture to the second aperture. A smaller second radius scribes an arc tangential to the arc of the first radius over a portion of the exterior surface of the housing. Alternately, the first and second radii may define the surface of the bore with the second radius extending over a portion of the exterior surface of the housing. The bore in the housing is definable by an additional aperture formed adjacent to the first aperture. The surface of the bore is defined by at least the first radius extending from the perimeters of the adjacent apertures.

Abstract: An improved electrical test probe has a electrically conductive strain relief adapter mounted on a substrate for accepting a conductive cable having a central conductor and an outer shielding conductor separated by a dielectric layer. The conductive cable is inserted into the strain relief adapter with the outer shielding conductor in electrical contact with the adapter. The substrate is disposed within an electrically conductive elongate hollow body with the body being deformed proximate the location of the strain relief adapter to secure the substrate in the body and to provide electrical continuity between the outer shielding conductor and the substrate and the outer shielding conductor and the hollow body. The adapter further provides strain relief for the center conductor of the conductive cable and mechanical support for the substrate.