Abstract: A method for determining a total radiation dosage received by an electronic component includes employing a radiation generator to expose the electronic component to an ionizing radiation within a contained environment of an inspection system. The method further includes measuring a total radiation dosage received by the electronic component based on a pre-determined position in the contained environment of the inspection system.

Abstract: Parts are exposed to liquid chromatography to generate a corresponding chromatogram, wherein the chromatogram is compared to a chromatogram of a genuine part to determine if the tested part is suspect counterfeit. Depending on the selected predetermined target analytes, the generated chromatogram can be used to assess an associated manufacturing process as conforming or non-conforming.

Abstract: A method of assessing a cleanliness of an assembly in a panel during a manufacturing process is provided, wherein an electrical signal of at least one of a predetermined voltage, current or frequency is applied across a first subset and a second subset of nonconnected electrical contacts in a test coupon associated with the assembly, such that the first subset and the second subset have different pitches. In one configuration, the test coupon is tested at higher voltages, currents or frequencies to a point of failure or above a predetermined threshold.

Abstract: A method for determining a total radiation dosage received by an electronic component includes employing a radiation generator to expose the electronic component to an ionizing radiation within a contained environment of an inspection system. The method further includes measuring a total radiation dosage received by the electronic component based on a pre-determined position in the contained environment of the inspection system.

Abstract: A method of assessing a cleanliness of an assembly in a panel during a manufacturing process is provided, wherein an electrical signal of at least one of a predetermined voltage, current or frequency is applied across a first subset and a second subset of nonconnected electrical contacts in a test coupon associated with the assembly, such that the first subset and the second subset have different pitches. In one configuration, the test coupon is tested at higher voltages, currents or frequencies to a point of failure or above a predetermined threshold.

Abstract: Parts are exposed to liquid chromatography to generate a corresponding chromatogram, wherein the chromatogram is compared to a chromatogram of a genuine part to determine if the tested part is suspect counterfeit. Depending on the selected predetermined target analytes, the generated chromatogram can be used to assess an associated manufacturing process as conforming or non-conforming.

Abstract: A method for counterfeit IC detection includes: providing a computer, an optical and an X-ray imager; optically imaging a package of one or more ICs; pattern matching the package image to identify an IC type; selecting one or more reference images from a reference library; X-ray imaging one or more ICs; performing in any order: comparing an internal lead frame structure of the one or more ICs to images from the reference library to determine a first numerical indicator; and determining a composition of the lead frame of the one or more ICs and to a corresponding composition from the reference library to determine a second numerical indicator; calculating an indication of authenticity based on the first numerical indicator and the second numerical indicator; and accepting or rejecting the one or more ICs based on the indication of authenticity. A system for counterfeit IC detection is also described.

Abstract: A method for counterfeit IC detection includes: providing a computer, an optical and an X-ray imager; optically imaging a package of one or more ICs; pattern matching the package image to identify an IC type; selecting one or more reference images from a reference library; X-ray imaging one or more ICs; performing in any order: comparing an internal lead frame structure of the one or more ICs to images from the reference library to determine a first numerical indicator; and determining a composition of the lead frame of the one or more ICs and to a corresponding composition from the reference library to determine a second numerical indicator; calculating an indication of authenticity based on the first numerical indicator and the second numerical indicator; and accepting or rejecting the one or more ICs based on the indication of authenticity. A system for counterfeit IC detection is also described.

Abstract: A method to create a reference library of known authentic die images includes die images which are known to be a correct representation of the manufacturer's original die mask set. Where actual literal copies of the original die mask set are unavailable, reasonable facsimile images are derived from images of known authentic ICs. The library of images, while mainly including a set of die images, can be further supplemented by package images, images of manufacturer's logos, text listings of known text markings, including, for example, known serial numbers and date codes, and graphical images from any suitable manufacturer publications. A system and method to determine the authenticity of ICs which includes a multi-faceted approach is also described.

Abstract: A portable heater has a housing with a base, an opposing open end, a sidewall extending between the base and the open end, an opening in the sidewall, and a lip in the sidewall proximate the open end. A fuel container support for receiving a fuel container is in the housing, proximate the base. A cover selectably coupled to the housing closes off the open end. The cover has a flue for receiving heat from a heating unit and directing the heat out of the housing.