Patents by Inventor Mark Norwil

Mark Norwil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packaging apparatus and method
    Patent number: 7672132
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: March 2, 2010
    Assignee: Intel Corporation
    Inventors: Thomas J Fitzgerald, Carl L. Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer
  • ELECTRONIC PACKAGING APPARATUS AND METHOD
    Publication number: 20070097650
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Application
    Filed: December 5, 2006
    Publication date: May 3, 2007
    Inventors: Thomas Fitzgerald, Carl Deppisch, Manjit Dhindsa, Mark Norwil, Matthew Schaenzer
  • Electronic packaging apparatus and method
    Patent number: 7160758
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 9, 2007
    Assignee: Intel Corporation
    Inventors: Thomas J Fitzgerald, Carl L. Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer
  • Electronic packaging apparatus and method
    Publication number: 20050218508
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Thomas Fitzgerald, Carl Deppisch, Manjit Dhindsa, Mark Norwil, Matthew Schaenzer