Abstract: A heat absorbent device is comprised of a container filled with a phase change material selected to melt at about 75° F. It is arranged to be installed in a room with business critical electronics equipment that requires constant cooling by a cooling system, typically, to about 72° F. In some embodiments, the container is comprised of a container for attaching to a T-rail of a ceiling tile system. In another embodiment, the container is comprised of a container with hooks for attaching to holes on computer cabinets. In yet another embodiment, the container is comprised of a ceiling tile with a plurality of individually sealed cells containing the phase change material. In the event of a cooling system failure and rapidly rising room temperature, the phase change material will begin absorbing heat and cooling the room when the room temperature has reached its melting point.