Abstract: A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions.

Abstract: A printed circuit board is installable into a slot of a cardedge connector such that contacts of the connector ride along electrically conductive, raised pads of the card. Each pad includes frontal edge segments which are inclined generally rearwardly toward a center axis of the pad so that if any of the contacts are laterally offset with respect to the center axis of its respective pad during installation, the offset contact will be re-directed toward the center axis in response to making engagement with one of the frontal edge segments.