Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

Abstract: An optical transceiver includes a silicon photonics substrate and multiple devices. The devices are configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals. The devices are each fabricated to include respectively a package substrate configured according to one of multiple different package substrate mounting technologies. Each package substrate among the multiple devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate. At least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.

Abstract: An optical transceiver includes a silicon photonics substrate and multiple devices. The devices are configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals. The devices are each fabricated to include respectively a package substrate configured according to one of multiple different package substrate mounting technologies. Each package substrate among the multiple devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate. At least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.

Abstract: An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals.

Abstract: A paint brush handle with a clip adapted to attach the paint brush to a side of a paint can, bucket, or similar container. An L-shaped clip extends from a side of the handle body; this L-shaped clip is adapted or configured to removably attach to a side of a paint can, bucket, or similar container. The L-shaped clip allows the paint brush to be suspended over a paint can, bucket, or similar container, so that any excess paint on the brush drains into the paint can and not onto any undesirable area, such as the floor or paint brush handle.

Abstract: An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical module.

Abstract: Techniques and systems for robotic aquaculture are described. In one embodiment, for example, a mariculture system may include an aquatic animal containment system operative to hold a population of aquatic animals, the aquatic animal containment system comprising an enclosed hull having a receptacle configured to receive a mechanical core, the mechanical core configured to store at least one sub-system to implement at least one function of mariculture system, and a position management system operative to maintain the enclosed hull at a depth below a surface of a body of water. Other embodiments are described.

Abstract: An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals.

Abstract: An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

Abstract: Techniques and systems for robotic aquaculture are described. In one embodiment, for example, a mariculture system may include an aquatic animal containment system operative to hold a population of aquatic animals, the aquatic animal containment system comprising an enclosed hull having a receptacle configured to receive a mechanical core, the mechanical core configured to store at least one sub-system to implement at least one function of mariculture system, and a position management system operative to maintain the enclosed hull at a depth below a surface of a body of water. Other embodiments are described.

Abstract: An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.

Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

Abstract: A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.

Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

Abstract: An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals.

Abstract: An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.

Abstract: An integrated optical transceiver includes a transmitter unit and a receiver unit each provided on a surface region of a substrate member. The transmitter unit includes four laser devices configured to output four laser lights and a set of four power splitter devices coupled to the four laser lights to split each of the four laser lights to two replicated transmit paths. The receiver unit has two replicated receive paths each including a photodetector device and a transimpedance amplifier device coupled to the photodetector device. A planar light circuit block is mounted on the substrate member and includes a multiplexer device configured to couple the four laser lights of the transmitter unit and multiplex to one output light delivered to an optical output port and a demultiplexer device configured to receive an input light from an optical input port and demultiplex to four input optical signals for the receiver unit.

Abstract: An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

Abstract: A system comprising a payment account generated by the payor and adapted to receive the payment from the payor and transfer the payment to the payee in at least one form of payment, a funding account to provide funds to a fund holding account which is adapted to provide the payment to the payment account, a payment processor to process the payment from the payor to the payment account and process the payment from the payment account to the payee, and a payee portal to be accessed by the payee and receive the payment from the payment account. The payment account is a dedicated account for only the payee, and the payee self-directs the transfer of funds and controls the form of payment made from the payment account. A method further comprising generating a payment account, providing funds to the payment account, and self-directing funds from the payment account.

Abstract: An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.