Patents by Inventor Mark Phillip Popovich
Mark Phillip Popovich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8445984Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: GrantFiled: May 3, 2011Date of Patent: May 21, 2013Assignees: Texas Instruments Incorporated, Amkor Technology, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffrey Alan Miks, Mark Phillip Popovich
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Publication number: 20110204464Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: ApplicationFiled: May 3, 2011Publication date: August 25, 2011Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Patent number: 7936033Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: GrantFiled: December 29, 2008Date of Patent: May 3, 2011Assignees: Texas Instruments Incorporated, Amkor Technology, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Publication number: 20100164081Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: ApplicationFiled: December 29, 2008Publication date: July 1, 2010Applicant: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Patent number: 5928598Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).Type: GrantFiled: May 9, 1997Date of Patent: July 27, 1999Assignee: Motorola, Inc.Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen
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Patent number: 5892417Abstract: A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.Type: GrantFiled: December 27, 1996Date of Patent: April 6, 1999Assignee: Motorola Inc.Inventors: Gary Carl Johnson, Michael J. Anderson, Gregory Jon Kennison, Jeffrey Eanes Christensen, Mark Phillip Popovich
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Patent number: 5702775Abstract: A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).Type: GrantFiled: December 26, 1995Date of Patent: December 30, 1997Assignee: Motorola, Inc.Inventors: Michael John Anderson, Gary Carl Johnson, Mark Phillip Popovich, Jeffrey Eames Christensen