Patents by Inventor Mark Pijaszek

Mark Pijaszek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11186047
    Abstract: The disclosure provides for a method including: a) forming a layered tubular member (12) by placing one or more outer layers (16) about an inner layer (14) and joining at one or more seams (56) along a length of the layered tubular member, wherein the one or more outer layers include a first resin impregnated therein; b) applying the first resin or a second resin at the one or more seams; c) creating one or more fillets (58) along the one or more seams with the first resin, the second resin, or an adhesive; and d) curing the first resin, the second resin, and the adhesive so that the layered tubular member, the first resin, the second resin, and the adhesive form a composite structure having a tubular shape.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 30, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Jay M. Tudor, David H. Bank, Jeffery D. Zawisza, Peter J. Schulz, Liangkai Ma, Mark Pijaszek, Mark Mirgon
  • Publication number: 20200391449
    Abstract: The disclosure provides for a method including: a) forming a layered tubular member (12) by placing one or more outer layers (16) about an inner layer (14) and joining at one or more seams (56) along a length of the layered tubular member, wherein the one or more outer layers include a first resin impregnated therein; b) applying the first resin or a second resin at the one or more seams; c) creating one or more fillets (58) along the one or more seams with the first resin, the second resin, or an adhesive; and d) curing the first resin, the second resin, and the adhesive so that the layered tubular member, the first resin, the second resin, and the adhesive form a composite structure having a tubular shape.
    Type: Application
    Filed: March 1, 2019
    Publication date: December 17, 2020
    Applicant: Dow Global Technologies LLC
    Inventors: Jay M. Tudor, David H. Bank, Jeffery D. Zawisza, Peter J. Schulz, Liangkai Ma, Mark Pijaszek, Mark Mirgon