Patents by Inventor Mark Pilip

Mark Pilip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230388241
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 30, 2023
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Patent number: 11803471
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: Apple Inc.
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasa Rangan Sridharan
  • Patent number: 11706150
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: July 18, 2023
    Assignee: Apple Inc.
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20230058989
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasan Rangan Sridharan
  • Publication number: 20220321490
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20220284163
    Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 8, 2022
    Inventors: Sergio Kolor, Dany Davidov, Nir Leshem, Mark Pilip