Abstract: Described herein are methodologies for employing biofilm bioreactors and hydrocarbonoclastic organisms to upscale the corn ethanol byproduct thin stillage or by products from distilleries or breweries into value-added hydrophobic chemicals like retinoids and lubricants.

Abstract: A system for producing a hydrophobic chemical includes circulating biofilm bioreactors for synthesizing the hydrophobic products and continuous extraction into an organic solvent phase. Various configurations can be employed for assembling the bioreactors into a production module. Extraction operations can be conducted in one or more extraction vessels. In some cases, product and solvent are separated using membrane separation techniques, with solvent being rerouted to the extraction vessel(s). Methods for the biotransformation of feedstocks into chemical products also are described.

Abstract: A system for producing a hydrophobic chemical includes circulating biofilm bioreactors for synthesizing the hydrophobic products and continuous extraction into an organic solvent phase. Various configurations can be employed for assembling the bioreactors into a production module. Extraction operations can be conducted in one or more extraction vessels. In some cases, product and solvent are separated using membrane separation techniques, with solvent being rerouted to the extraction vessel(s). Methods for the biotransformation of feedstocks into chemical products also are described.

Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bight copper or copper alloy on substrates.

Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.

Abstract: A lactone solvent swell composition and method of using the composition. The lactone swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The lactone solvent swell compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.