Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bight copper or copper alloy on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.

Abstract: A lactone solvent swell composition and method of using the composition. The lactone swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The lactone solvent swell compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.

Abstract: A load lock of a semiconductor processing tool includes a plurality of antechambers selectively isolatable from the main chamber of the load lock. The antechambers can function in tandem, serving as staging areas to enable maximum efficiency of wafer handling as the tool transfers wafers between various processing stages. The antechambers can also operate independently, with one antechamber isolated from the evacuated main load lock chamber and then vented, thereby permitting loading or unloading of cassettes or wafers while the main load lock chamber, the tool, and other antechambers remain occupied with wafer processing. In addition to wafer evacuation/venting, load lock antechambers in accordance with embodiments of the present invention may host a variety of other pre- or post-processing activities, such as wafer heating/cooling, exposure to purge/ambient gases, wafer orientation, wafer center-finding, and metrology.

Abstract: A method and apparatus for analyzing schedules for multi-cluster tools that are used in semiconductor wafer processing and similar manufacturing applications. The method and apparatus comprise a schedule analyzer and a pass-through chamber manager. The apparatus allows the user to analyze N! possible scheduling routines (algorithms) for a given multi-cluster tool configuration and a given N-step process sequence. The invention derives a plurality of possible scheduling algorithms for a given set of input parameters and then compares the algorithms by allowing either the user or an automated process to assign each processing step within the proposed schedule a rank ordered priority. Other process or wafer movement parameters may also be given ranges such that the invention can automatically derive optimal schedules with respect to various parameter values.