Patents by Inventor Mark R. Bonneau

Mark R. Bonneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
    Patent number: 6750301
    Abstract: Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: June 15, 2004
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Mark R. Bonneau, Yun K. Shin, Gina Hoang, Martin Sobczak