Patents by Inventor Mark R. Brinthaupt

Mark R. Brinthaupt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid surface mount and pin thru hole circuit board
    Patent number: 6521842
    Abstract: A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: February 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Mark R. Brinthaupt, III, Lisa J. Jimarez, William F. Wildey
  • HYBRID SURFACE MOUNT AND PIN THRU HOLE CIRCUIT BOARD
    Publication number: 20030006061
    Abstract: A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.
    Type: Application
    Filed: June 20, 2001
    Publication date: January 9, 2003
    Applicant: International Business Machines Corporation
    Inventors: Mark R. Brinthaupt, Lisa J. Jimarez, William F. Wildey