Abstract: An inspection device for inspecting explosive environments. The inspection device may include a camera and an intrinsic safety barrier. The intrinsic safety barrier may be configured to receive camera power and control signals and transmit intrinsically safe camera power and control signals to the camera.

Abstract: An inspection device for inspecting explosive environments. The inspection device may include a camera and an intrinsic safety barrier. The intrinsic safety barrier may be configured to receive camera power and control signals and transmit intrinsically safe camera power and control signals to the camera.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract: An instrument pin member is provided that is capable of measuring bending moments and optionally of measuring bending and axial strain in real or near real time. The instrumented pin member includes a pin member body disposed about a pin member axis, wherein the pin member body includes a bending portion. A sensing device is positioned at the pin member body within the bending portion for sensing a bending strain in the bending portion exclusive of a net axial strain, and for outputting a sensor measurement signal representative of the bending strain. A sensor measurement signal output device is provided for outputting the sensor measurement signal from the sensing device. A related system includes a plurality of pin members, among other things. Related methods also are disclosed.

Abstract: An instrumented pin member is provided that is capable of measuring bending moments, and optionally of measuring bending and axial strain in real or near real time. The instrumented pin member includes a pin member body disposed about a pin member axis, wherein the pin member body includes a bending portion. A sensing device is positioned at the pin member body within the bending portion for sensing a bending strain in the bending portion exclusive of a net axial strain, and for outputting a sensor measurement signal representative of the bending strain. A sensor measurement signal output device is provided for outputting the sensor measurement signal from the sensor device. A related system includes a plurality of pin members, among other things. Related methods also are disclosed.