Abstract: Method of cooling electronic systems and semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.

Abstract: An integrated circuit is mounted on and interconnected with a circuit board by an array of electrically conductive columns. The assembly is fabricated by initially interconnecting the integrated circuit and the circuit board with an array of reflowable electrically conductive solder balls that correspond to the columns respectively. The circuit board is held with the integrated circuit extending downwardly therefrom. Sufficient heat is applied to cause the solder balls to reflow. The integrated circuit is pulled downwardly away from the circuit board by gravity such that the balls are stretched to form the columns, and the assembly is allowed to cool such that the columns solidify. A fixture may be provided against which the integrated circuit abuts after it has moved away from the circuit board by a predetermined distance such that the columns have a precisely determined height.

Abstract: A planar substrate is attached to a face of a semiconductor die. The semiconductor die is electrically connected to a printed wiring board and encapsulation material covers the peripheral edges of the planar substrate, semiconductor die, and means for interconnecting the die and printed wiring board. An exterior face of the planar substrate remains exposed and may be utilized in pick and place automatic assembly. The exterior face of the planar substrate may also be utilized for attachment of an external heat sink for improved heat transfer from the semiconductor device. The planar substrate may be comprised of silicon, ceramic, metal or any other stiff material so long as the temperature coefficient of expansion is similar to that of the semiconductor die. A flip-chip semiconductor die may also be utilized without a planar substrate wherein the nonactive face of the die is exposed.

Abstract: Method and apparatus for cooling an electronic dissipate heat. The method includes the steps of providing a heat sink made from a powdered metal, placing the heat sink in thermal communication with the electronic device and, in one preferred embodiment, circulating an ambient fluid about the heat sink. The heat sink may have a first portion configured to be in thermal communication with the electronic device and a second portion configured to dissipate heat to an ambient fluid. In one preferred embodiment the powdered metal used to form the heat sink includes copper. The powdered metal forming the heat sink may also be at least partially fused. The heat sink structure may be an integral portion of a package for an integrated circuit structure. The heat sink may alternatively be secured to the electronic device with a thermally conductive adhesive. One configuration of the heat sink may include a plurality of posts projecting from a generally flat surface.

Abstract: Apparatus for use in cooling an integrated circuit structure. The apparatus includes a heat sink having a first portion configured for thermal engagement with an integrated circuit device and a second portion configured for the dissipation of heat into an ambient fluid, such as air. The heat sink is made from a powdered metal which, in one preferred embodiment, includes copper. The heat sink may be formed from the plurality of discrete layers, each layer having a button projecting from one surface, and a depression formed in an opposing surface. The depression is configured to receive a projecting button portion from another layer. In an alternative embodiment the heat sink includes a plurality of plugs projecting from the generally flat surface.

Abstract: An ASIC type microcircuit package assembly has a die of at least about 20 millimeters square in size and utilizes as a die attach a polymeric adhesive incorporating a conductive filler. Such microcircuit package assemblies are produced by bonding the die to a substrate with the die attach, curing the die attach, and hermetically sealing the die bonded to the substrate. The microcircuit package assemblies thereby produced are characterized by stability at temperatures of up to about 360.degree. C. and under conditions of stress corresponding to a 12 pound pull following 1,000 temperature cycles between -65.degree. and 150.degree. C., and having a moisture level of less than about 5000 ppm.

Abstract: A heat transfer device in the form of a bandanna-like neckband has a main body of flexible fabric material and a pocket lengthwise centrally located for receiving an elongated heat transfer element in the form of a multi-cellular reusable coolant pouch therein. The lengths of the main body and pocket are chosen to place the heat transfer element about the back and sides of the neck, while leaving the main body unobstructed at free ends to permit loose tying to join the ends in front of the neck. The widths of the main body and pocket are chosen to enable single or multiple layers of fabric material to be optionally interposed between the heat transfer element and the neck.

Abstract: A semiconductor device is mounted to one face of a printed wiring board (PWB). A heat sink is mounted to an opposite face of the board, opposite the die. The heat sink has a plurality (at least four) "nubs" protruding through a like plurality of holes in the board in the region of the die. In this manner, the nubs conduct heat from the die, through the board, to the heat sink. Preferably, the nubs are sized and shaped to press fit into the holes. Preferably, the holes are plated. Preferably, the heat sink is formed of powdered metal, such as aluminum, copper or a copper/tungsten alloy. The die is attached to the board by any suitable method, such as epoxy and wire bonding, tape automated bonding (TAB), etc. After the heat sink is mounted to the board, the die is encapsulated with resin. A multi-chip module using the novel heat sink structure is also disclosed.

Abstract: A method of making a plastic-packaged semiconductor device, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed cirucit boards for aiding in alignment of the device with the board.

Abstract: A plastic-packaged semiconductor device, method of making same, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed circuit boards, aiding in alignment of the device with the board.

Abstract: A low-cost watch band and case comprises a receptacle for receiving a watch module, switch protuberances integrally formed with the sidewall of the receptale for actuating function switches on the watch module, and a watch band integrally formed with the receptacle for attaching to the user's arm.

Abstract: A watch case containing at least one opening, in combination with means for sealing said opening comprising a plate of circular material containing on one surface thereof a resilient disc shaped material with an edge having a concave outward shape. In a preferred embodiment the plate compresses a stainless disc and the resilient material comprises neoprene rubber.

Abstract: A watch case and band in combination comprising a back portion containing on the outer periphery thereof first locking means; a center portion comprising a portion of the band containing therein an opening sufficient in size to allow a watch module to pass therethrough and having in the outer periphery of the band around said opening a plurality of smaller openings in alignment with said first locking means; and a top portion having in the outer periphery thereof second locking means located so as to mate with said first locking means locking through said plurality of smaller openings in said band.

Abstract: A new and improved case for electronic wristwatch modules, which case has an improved means for activating the watch display means. The new case of this invention comprises a frame for supporting a module containing a frequency standard, a frequency divider, an electro-optical display means, and switching means for operating the display means; at least one bar retained in an edge of the frame; means for biasing the bar away from the frame; and, means coupling the bar to the switching means, whereby pressure exerted on the bar operates the display means.

Abstract: Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.