Patents by Inventor Mark R. Shaffer

Mark R. Shaffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11108383
    Abstract: A clock phase control circuit includes a clock input gate module, first and second shift register divider modules, and a multiplexer. The clock input gate module is configured to produce, based on an oscillating input clock signal, first and second intermediate clock signals. The first shift register divider module is configured to produce at least one first phase clock signal based on the first intermediate clock signal, where the at least one first phase clock signal has a different frequency than the first intermediate clock signal. The second shift register divider module is configured to produce at least one second phase clock signal based on the second intermediate clock signal, where the at least one second phase clock signal has a different frequency than the second intermediate clock signal. The multiplexer is configured to produce an output clock signal by selecting one of the first or second phase clock signals.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 31, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: David D. Moser, Michael J. Frack, Mark R. Shaffer, Daniel L. Stanley
  • Patent number: 10990727
    Abstract: An IC design enhancing tool for automatically reviewing and environmentally hardening an IC design layout. The IC design enhancing tool may be realized, for example, in software that scans through an IC netlist generated by an electronic design automation (EDA) tool and replaces components that are not compliant with one or more hardening criteria. The newly created netlist can then be re-checked by the EDA tool and an iterative process takes place between the EDA tool and the IC design enhancing tool until the final design layout is fully compliant for a given environment. Interrogation of the IC design layout involves determining if at least a portion of the hardware layout netlist meets one or more predetermined hardening criteria. If it does not, then one or more of the hardware components are replaced using one or more predefined hardened components.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: April 27, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Brian A. Saari, Stephen A. Chadwick, Jason T. Dowling, Michael J. Frack, David D. Moser, Mark R. Shaffer
  • Patent number: 7419373
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between the two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: September 2, 2008
    Assignee: Alliant Techsystems Inc.
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie, Jr.
  • Patent number: 6881374
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: April 19, 2005
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie, Jr.
  • Publication number: 20030062118
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between the two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Application
    Filed: September 24, 2002
    Publication date: April 3, 2003
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie