Patents by Inventor Mark Reece

Mark Reece has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150354033
    Abstract: Shape memory alloys containing Ni, Ti, and Pt or Pd display superelastic behavior. The superelasticity was shown in a range of temperatures around the austenite finish shape memory transformation temperature. The superelasticity range was approximately 210-280° C. for these alloys. Shape memory alloys that exhibit superelasticity at high temperatures will enable a new class of mechanical sensors and actuators.
    Type: Application
    Filed: September 18, 2014
    Publication date: December 10, 2015
    Inventors: Donald F. Susan, James R. McElhanon, Thomas E. Buchheit, Jordan E. Massad, John R. DeBassige, Donald R. Bradley, Mark Reece, Ronald D. Noebe
  • Patent number: 7216821
    Abstract: A pressurized fluid handling nozzle has a body with a first end and a second end, a fluid conduit and a recess at the second end. The first end is configured for connection to a pressurized fluid source. The fluid conduit has an inlet at the first end and an outlet at the recess. The nozzle uses the Bernoulli effect for lifting a part.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: May 15, 2007
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Mark Reece, Gerald A. Knorovsky, Danny O. MacCallum
  • Patent number: 6827134
    Abstract: A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: December 7, 2004
    Assignee: Sandia Corporation
    Inventors: Michael J. Rightley, Douglas R. Adkins, James J. Mulhall, Charles V. Robino, Mark Reece, Paul M. Smith, Chris P. Tigges
  • Patent number: 6581438
    Abstract: A capillary test specimen, method, and system for visualizing and quantifying capillary flow of liquids under realistic conditions, including polymer underfilling, injection molding, soldering, brazing, and casting. The capillary test specimen simulates complex joint geometries and has an open cross-section to permit easy visual access from the side. A high-speed, high-magnification camera system records the location and shape of the moving liquid front in real-time, in-situ as it flows out of a source cavity, through an open capillary channel between two surfaces having a controlled capillary gap, and into an open fillet cavity, where it subsequently forms a fillet on free surfaces that have been configured to simulate realistic joint geometries. Electric resistance heating rapidly heats the test specimen, without using a furnace.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: June 24, 2003
    Assignee: Sandia Corporation
    Inventors: Aaron C. Hall, F. Michael Hosking, Mark Reece